Beam type micro-resonance device with low-thermal-elasticity damping structure

The invention relates to the field of micro-electromechanical systems (MEMS), and discloses a beam type tympanic membrane bionic micro-resonance device with a low thermal elastic damping structure, which comprises a resonance body and a substrate. Two ends of the resonance body are fixed on the subs...

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Hauptverfasser: TAI YONGPENG, CHEN NING, ZHOU KAI
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creator TAI YONGPENG
CHEN NING
ZHOU KAI
description The invention relates to the field of micro-electromechanical systems (MEMS), and discloses a beam type tympanic membrane bionic micro-resonance device with a low thermal elastic damping structure, which comprises a resonance body and a substrate. Two ends of the resonance body are fixed on the substrate to form fixed constraint. The resonance body is of a tympanic membrane bionic structure, and the section profile is similar to the tympanic membrane of a human body and is obtained through a first-order Bessel function. The resonance body generates bending strain and tensile strain during vibration, and the tensile strain does not generate thermal elastic dissipation, so that the structure provided by the invention can realize lower thermal elastic damping. 本发明涉及微机电系统MEMS领域,公布了一种具有低热弹性阻尼结构的梁式鼓膜仿生微谐振器件,包括:谐振体,基底。谐振体两端固定在基底上,形成固定约束。谐振体为鼓膜仿生结构,截面轮廓近似于人体鼓膜,由一阶贝塞尔函数获得。谐振体在振动时不仅产生弯曲应变,还会出现拉伸应变,而拉伸应变不产生热弹性耗散,所以本发明的结构能实现较低的热弹性阻尼。
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subjects BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
title Beam type micro-resonance device with low-thermal-elasticity damping structure
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