Gene sequencing chip and packaging method thereof

The invention provides a gene sequencing chip and a packaging method thereof. The chip comprises a protecting frame, an aminated substrate and a cover plate, wherein the aminated substrate is arrangedin the protecting frame and the cover plate stacks on the substrate. The method is characterized in that the contact areas of the protecting frame, the substrate and the cover plate are adhered through the curing reaction of coated silica gel to form a sealed structure, wherein the silica gel comprises one or the combination of dealcoholized silica gel, deaminated silica gel and deamidized silicagel, and the silica gel and the curing reaction byproduct of the silica gel do not have reaction with amino. The method has the advantages that the silica gel series glue which does not have reactionwith the amino is used to perform adhering and sealing, the problem that the glue pollutes the surface of the chip during the packaging of the aminated chip is solved effectively, complete sequencingdata is guaranteed, and seq