Epoxy resin composition for packaging semiconductor device and semiconductor device encapsulated using the same

The present invention provides an epoxy resin composition for packaging a semiconductor device and a semiconductor device packaged using the epoxy resin composition. The epoxy resin composition includes: an epoxy resin; a curing agent; and a first inorganic filler. The first inorganic filler include...

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Bibliographische Detailangaben
Hauptverfasser:	YOON JI AH, HONG IL GEUN, KATOU TOMOKO, PARK YONG YEOP, BAE KYOUNG CHUL, KIM MIN SOO, LEE DONG HWAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention provides an epoxy resin composition for packaging a semiconductor device and a semiconductor device packaged using the epoxy resin composition. The epoxy resin composition includes: an epoxy resin; a curing agent; and a first inorganic filler. The first inorganic filler includes at least one type of metal particles selected from copper particles, nickel particles, aluminum particles, silver particles, and gold particles. The metal particles are coated with at least one of silica and alumina. 本发明提供一种用于封装半导体装置的环氧树脂组成物和使用所述环氧树脂组成物封装的半导体装置。环氧树脂组成物包含：环氧树脂；固化剂；以及第一无机填充剂，所述第一无机填充剂包含由铜颗粒、镍颗粒、铝颗粒、银颗粒以及金颗粒中选出的至少一个类型的金属颗粒，所述金属颗粒用由硅石和氧化铝中选出的至少一者包覆。