Semiconductor test socket with mixed coaxial structure and preparation method thereof
The invention relates to a semiconductor test socket with a mixed coaxial structure and a preparation method thereof. The semiconductor test socket comprises a test socket positioning plate, an insulation test socket parent body, an embedded conductive socket parent body, an embedded conductive sock...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a semiconductor test socket with a mixed coaxial structure and a preparation method thereof. The semiconductor test socket comprises a test socket positioning plate, an insulation test socket parent body, an embedded conductive socket parent body, an embedded conductive socket cover plate and an insulation test socket cover plate, wherein the test socket positioning plate,the insulation test socket parent body and the insulation test socket cover plate are sequentially arranged from top to bottom, a notch is formed in the insulation test socket parent body, and the embedded conductive socket parent body and the embedded conductive socket cover plate are arranged in the notch. The semiconductor test socket of the invention has the beneficial effects that: a coaxialstructure made of conductive metal is utilized to achieve good isolation between channels, thereby greatly reducing manufacturing cost and production period of the test socket, at the same time, a high-frequency signal part c |
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