Anti-reverse-insertion packaging frame and packaging body
The invention discloses an anti-reverse-insertion packaging frame and packaging body. The packaging frame comprises a frame body, wherein the frame body is provided with a plurality of base islands and a plurality of pins, the plurality of pins are respectively arranged at two sides of the frame bod...
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| creator | REN SHIDING XIE DASHENG |
| description | The invention discloses an anti-reverse-insertion packaging frame and packaging body. The packaging frame comprises a frame body, wherein the frame body is provided with a plurality of base islands and a plurality of pins, the plurality of pins are respectively arranged at two sides of the frame body, and the pins at two sides of the frame body are asymmetric in size. According to the invention, the pins on the two sides of the frame body are set to be asymmetric in size, so that the packaging body is prevented from being inserted reversely.
本发明公开了一种防插反的封装框架及封装体，所述封装框架包括框架本体，所述框架本体上设置有若干个基岛以及若干个引脚，若干个所述引脚分别设置在框架本体两侧，所述框架本体两侧的引脚尺寸互不对称。本发明通过将框架本体两侧的引脚的尺寸设置为互不对称，以防止封装体插反。 |
| format | Patent |
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本发明公开了一种防插反的封装框架及封装体，所述封装框架包括框架本体，所述框架本体上设置有若干个基岛以及若干个引脚，若干个所述引脚分别设置在框架本体两侧，所述框架本体两侧的引脚尺寸互不对称。本发明通过将框架本体两侧的引脚的尺寸设置为互不对称，以防止封装体插反。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200107&DB=EPODOC&CC=CN&NR=110660772A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200107&DB=EPODOC&CC=CN&NR=110660772A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>REN SHIDING</creatorcontrib><creatorcontrib>XIE DASHENG</creatorcontrib><title>Anti-reverse-insertion packaging frame and packaging body</title><description>The invention discloses an anti-reverse-insertion packaging frame and packaging body. The packaging frame comprises a frame body, wherein the frame body is provided with a plurality of base islands and a plurality of pins, the plurality of pins are respectively arranged at two sides of the frame body, and the pins at two sides of the frame body are asymmetric in size. According to the invention, the pins on the two sides of the frame body are set to be asymmetric in size, so that the packaging body is prevented from being inserted reversely.
本发明公开了一种防插反的封装框架及封装体，所述封装框架包括框架本体，所述框架本体上设置有若干个基岛以及若干个引脚，若干个所述引脚分别设置在框架本体两侧，所述框架本体两侧的引脚尺寸互不对称。本发明通过将框架本体两侧的引脚的尺寸设置为互不对称，以防止封装体插反。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB0zCvJ1C1KLUstKk7VzcwrTi0qyczPUyhITM5OTM_MS1dIK0rMTVVIzEtBEkvKT6nkYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUDFqXmpJfHOfoaGBmZmBubmRo7GxKgBAErBLq8</recordid><startdate>20200107</startdate><enddate>20200107</enddate><creator>REN SHIDING</creator><creator>XIE DASHENG</creator><scope>EVB</scope></search><sort><creationdate>20200107</creationdate><title>Anti-reverse-insertion packaging frame and packaging body</title><author>REN SHIDING ; XIE DASHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110660772A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>REN SHIDING</creatorcontrib><creatorcontrib>XIE DASHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>REN SHIDING</au><au>XIE DASHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Anti-reverse-insertion packaging frame and packaging body</title><date>2020-01-07</date><risdate>2020</risdate><abstract>The invention discloses an anti-reverse-insertion packaging frame and packaging body. The packaging frame comprises a frame body, wherein the frame body is provided with a plurality of base islands and a plurality of pins, the plurality of pins are respectively arranged at two sides of the frame body, and the pins at two sides of the frame body are asymmetric in size. According to the invention, the pins on the two sides of the frame body are set to be asymmetric in size, so that the packaging body is prevented from being inserted reversely.
本发明公开了一种防插反的封装框架及封装体，所述封装框架包括框架本体，所述框架本体上设置有若干个基岛以及若干个引脚，若干个所述引脚分别设置在框架本体两侧，所述框架本体两侧的引脚尺寸互不对称。本发明通过将框架本体两侧的引脚的尺寸设置为互不对称，以防止封装体插反。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Anti-reverse-insertion packaging frame and packaging body |
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