PICKUP DEVICE AND PICKUP METHOD

PICKUP DEVICE AND PICKUP METHOD

The present invention comprises: a stage (20) that includes a suction surface (22) that suctions a sheet (12); a push-up member (30) that pushes up the sheet (12); and a three-way valve (67) that switches the opening pressure of an opening (23) between a first pressure that is near a vacuum and a se...

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1. Verfasser: NAGANO KAZUAKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator NAGANO KAZUAKI
description The present invention comprises: a stage (20) that includes a suction surface (22) that suctions a sheet (12); a push-up member (30) that pushes up the sheet (12); and a three-way valve (67) that switches the opening pressure of an opening (23) between a first pressure that is near a vacuum and a second pressure that is near atmospheric pressure. When a semiconductor die (15) is picked up togetherwith a viscoelastic film (11), the opening pressure is caused to vibrate at a prescribed frequency that corresponds to the viscoelastic characteristics of the viscoelastic film (11) when the suctionpressure of the suction surface (22) is set at a third pressure that is near a vacuum, and the sheet (12) is pushed up by the push-up member (30). A thin semiconductor die affixed to the surface of the sheet by the viscoelastic film is thereby picked up from the surface of the sheet together with the viscoelastic film. 本发明的拾取装置具备：平台(20)，含有吸附片材(12)的吸附面(22)；上推构件(30)，将片材(12)上推；以及三向阀(67)，使开口(23)的开口压力在接近真空的第一压力与接近大气压的第二压力之间切换；并
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When a semiconductor die (15) is picked up togetherwith a viscoelastic film (11), the opening pressure is caused to vibrate at a prescribed frequency that corresponds to the viscoelastic characteristics of the viscoelastic film (11) when the suctionpressure of the suction surface (22) is set at a third pressure that is near a vacuum, and the sheet (12) is pushed up by the push-up member (30). A thin semiconductor die affixed to the surface of the sheet by the viscoelastic film is thereby picked up from the surface of the sheet together with the viscoelastic film. 本发明的拾取装置具备：平台(20)，含有吸附片材(12)的吸附面(22)；上推构件(30)，将片材(12)上推；以及三向阀(67)，使开口(23)的开口压力在接近真空的第一压力与接近大气压的第二压力之间切换；并</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200103&amp;DB=EPODOC&amp;CC=CN&amp;NR=110651362A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200103&amp;DB=EPODOC&amp;CC=CN&amp;NR=110651362A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGANO KAZUAKI</creatorcontrib><title>PICKUP DEVICE AND PICKUP METHOD</title><description>The present invention comprises: a stage (20) that includes a suction surface (22) that suctions a sheet (12); a push-up member (30) that pushes up the sheet (12); and a three-way valve (67) that switches the opening pressure of an opening (23) between a first pressure that is near a vacuum and a second pressure that is near atmospheric pressure. 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When a semiconductor die (15) is picked up togetherwith a viscoelastic film (11), the opening pressure is caused to vibrate at a prescribed frequency that corresponds to the viscoelastic characteristics of the viscoelastic film (11) when the suctionpressure of the suction surface (22) is set at a third pressure that is near a vacuum, and the sheet (12) is pushed up by the push-up member (30). A thin semiconductor die affixed to the surface of the sheet by the viscoelastic film is thereby picked up from the surface of the sheet together with the viscoelastic film. 本发明的拾取装置具备：平台(20)，含有吸附片材(12)的吸附面(22)；上推构件(30)，将片材(12)上推；以及三向阀(67)，使开口(23)的开口压力在接近真空的第一压力与接近大气压的第二压力之间切换；并</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PICKUP DEVICE AND PICKUP METHOD
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