Cover plate assembly and manufacturing method thereof, and electronic equipment

The invention provides a cover plate assembly. The cover plate assembly covers an electronic device body. The cover plate assembly comprises a cover plate, a lens and a supporting piece, wherein the cover plate is provided with a through hole, the through hole penetrates through a first surface and...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LIAO XINFENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION
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