Cover plate assembly and manufacturing method thereof, and electronic equipment
The invention provides a cover plate assembly. The cover plate assembly covers an electronic device body. The cover plate assembly comprises a cover plate, a lens and a supporting piece, wherein the cover plate is provided with a through hole, the through hole penetrates through a first surface and...
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creator | LIAO XINFENG |
description | The invention provides a cover plate assembly. The cover plate assembly covers an electronic device body. The cover plate assembly comprises a cover plate, a lens and a supporting piece, wherein the cover plate is provided with a through hole, the through hole penetrates through a first surface and a second surface, which are opposite to each other, of the cover plate, the lens is accommodated inthe through hole, the lens comprises a bottom surface, a top surface and a side surface, the bottom surface and the top surface are oppositely arranged, the side surface is connected with the bottom surface and the top surface, the side surface of the lens is fixedly connected with an inner side wall of the through hole, and the supporting piece is arranged close to the bottom surface of the lensand is fixedly connected with the second surface of the cover plate. The cover plate assembly is advantaged in that the lens is fixedly connected with the inner side wall of the cover plate through hole, so that the lens is fl |
format | Patent |
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language | chi ; eng |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION |
title | Cover plate assembly and manufacturing method thereof, and electronic equipment |
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