Processing method for laminating thick-copper thin cover film

The invention discloses a processing method for laminating a thick-copper thin cover film, which comprises the steps of S1, laminating a bearing film on the end surface of the cover film before the cover film is processed according to an FPC processing flow; S2, aligning the FPC and the cover film through a sleeving jig; S3, carrying out false pressing on the FPC with the cover film, and fixing the relative position between the cover film and the FPC; S4, performing hot pressing by using a vacuum quick pressing machine to enable the glue to be fully bonded with the copper surface of the FPC; and S5, tearing off the bearing film on the surface of the cover film after the FPC is subjected to thermal lamination so as to finish the processing. The laminating difficulty of a thin cover film issolved, and the operability of selecting and attaching the bearing film is improved; the pyrograph laminating before hot pressing is additionally carried out, the temperature is lower than that of thehot pressuring, glue over