Low-temperature soldering flux of photovoltaic soldering strip for HIT heterojunction and preparation method
The invention relates to a low-temperature soldering flux of a photovoltaic soldering strip for a HIT heterojunction and a preparation method. The low-temperature soldering flux is prepared from the following raw materials including, by mass, 35% - 40% of bismuth, 1.5%-2.5% of silver powder, 0.01% -...
Gespeichert in:
Hauptverfasser: | , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | GENG XINTONG HU XIAOGANG CAI FAYU ZHANG QUN ZHAO JUN WANG RUJIE ZHANG WEI ZHANG QIANG LENG QINGSONG |
description | The invention relates to a low-temperature soldering flux of a photovoltaic soldering strip for a HIT heterojunction and a preparation method. The low-temperature soldering flux is prepared from the following raw materials including, by mass, 35% - 40% of bismuth, 1.5%-2.5% of silver powder, 0.01% - 0.02% of copper and the balance tin. The low-temperature soldering flux adopts spherical silver powder and other conductive materials which are identical with conductive materials of battery piece grid line silver paste, the ingredients and the form particle size levels are within the same specification range, even under a low-temperature soldering condition, the materials are promoted to undergo eutectic transformation, so that a formed electrode interference metal intermediate compound is more uniform and denser, conductive phase network contact is more complete, and therefore the conductivity, the adhesion force (namely soldering tension force) and reliability (namely TC200 and DH1000) of the silver electrode a |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN110549030A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN110549030A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN110549030A3</originalsourceid><addsrcrecordid>eNqNjDEKwkAQRdNYiHqH8QCBhGhhKUGJIFbpw5LMuiubnWF2oh5fBQtLq8_jPf48C2d65IojoxidBCFRGFB8vIIN0xPIAjtSulNQ4_sfnVQ8gyWB5tSCQ0Wh2xR79RTBxAFYkM379cMjqqNhmc2sCQlX311k6-OhrZscmTpMbHqMqF19Kctiu9kVVbGv_mletVxCtA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Low-temperature soldering flux of photovoltaic soldering strip for HIT heterojunction and preparation method</title><source>esp@cenet</source><creator>GENG XINTONG ; HU XIAOGANG ; CAI FAYU ; ZHANG QUN ; ZHAO JUN ; WANG RUJIE ; ZHANG WEI ; ZHANG QIANG ; LENG QINGSONG</creator><creatorcontrib>GENG XINTONG ; HU XIAOGANG ; CAI FAYU ; ZHANG QUN ; ZHAO JUN ; WANG RUJIE ; ZHANG WEI ; ZHANG QIANG ; LENG QINGSONG</creatorcontrib><description>The invention relates to a low-temperature soldering flux of a photovoltaic soldering strip for a HIT heterojunction and a preparation method. The low-temperature soldering flux is prepared from the following raw materials including, by mass, 35% - 40% of bismuth, 1.5%-2.5% of silver powder, 0.01% - 0.02% of copper and the balance tin. The low-temperature soldering flux adopts spherical silver powder and other conductive materials which are identical with conductive materials of battery piece grid line silver paste, the ingredients and the form particle size levels are within the same specification range, even under a low-temperature soldering condition, the materials are promoted to undergo eutectic transformation, so that a formed electrode interference metal intermediate compound is more uniform and denser, conductive phase network contact is more complete, and therefore the conductivity, the adhesion force (namely soldering tension force) and reliability (namely TC200 and DH1000) of the silver electrode a</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191210&DB=EPODOC&CC=CN&NR=110549030A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191210&DB=EPODOC&CC=CN&NR=110549030A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GENG XINTONG</creatorcontrib><creatorcontrib>HU XIAOGANG</creatorcontrib><creatorcontrib>CAI FAYU</creatorcontrib><creatorcontrib>ZHANG QUN</creatorcontrib><creatorcontrib>ZHAO JUN</creatorcontrib><creatorcontrib>WANG RUJIE</creatorcontrib><creatorcontrib>ZHANG WEI</creatorcontrib><creatorcontrib>ZHANG QIANG</creatorcontrib><creatorcontrib>LENG QINGSONG</creatorcontrib><title>Low-temperature soldering flux of photovoltaic soldering strip for HIT heterojunction and preparation method</title><description>The invention relates to a low-temperature soldering flux of a photovoltaic soldering strip for a HIT heterojunction and a preparation method. The low-temperature soldering flux is prepared from the following raw materials including, by mass, 35% - 40% of bismuth, 1.5%-2.5% of silver powder, 0.01% - 0.02% of copper and the balance tin. The low-temperature soldering flux adopts spherical silver powder and other conductive materials which are identical with conductive materials of battery piece grid line silver paste, the ingredients and the form particle size levels are within the same specification range, even under a low-temperature soldering condition, the materials are promoted to undergo eutectic transformation, so that a formed electrode interference metal intermediate compound is more uniform and denser, conductive phase network contact is more complete, and therefore the conductivity, the adhesion force (namely soldering tension force) and reliability (namely TC200 and DH1000) of the silver electrode a</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEKwkAQRdNYiHqH8QCBhGhhKUGJIFbpw5LMuiubnWF2oh5fBQtLq8_jPf48C2d65IojoxidBCFRGFB8vIIN0xPIAjtSulNQ4_sfnVQ8gyWB5tSCQ0Wh2xR79RTBxAFYkM379cMjqqNhmc2sCQlX311k6-OhrZscmTpMbHqMqF19Kctiu9kVVbGv_mletVxCtA</recordid><startdate>20191210</startdate><enddate>20191210</enddate><creator>GENG XINTONG</creator><creator>HU XIAOGANG</creator><creator>CAI FAYU</creator><creator>ZHANG QUN</creator><creator>ZHAO JUN</creator><creator>WANG RUJIE</creator><creator>ZHANG WEI</creator><creator>ZHANG QIANG</creator><creator>LENG QINGSONG</creator><scope>EVB</scope></search><sort><creationdate>20191210</creationdate><title>Low-temperature soldering flux of photovoltaic soldering strip for HIT heterojunction and preparation method</title><author>GENG XINTONG ; HU XIAOGANG ; CAI FAYU ; ZHANG QUN ; ZHAO JUN ; WANG RUJIE ; ZHANG WEI ; ZHANG QIANG ; LENG QINGSONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110549030A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>GENG XINTONG</creatorcontrib><creatorcontrib>HU XIAOGANG</creatorcontrib><creatorcontrib>CAI FAYU</creatorcontrib><creatorcontrib>ZHANG QUN</creatorcontrib><creatorcontrib>ZHAO JUN</creatorcontrib><creatorcontrib>WANG RUJIE</creatorcontrib><creatorcontrib>ZHANG WEI</creatorcontrib><creatorcontrib>ZHANG QIANG</creatorcontrib><creatorcontrib>LENG QINGSONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GENG XINTONG</au><au>HU XIAOGANG</au><au>CAI FAYU</au><au>ZHANG QUN</au><au>ZHAO JUN</au><au>WANG RUJIE</au><au>ZHANG WEI</au><au>ZHANG QIANG</au><au>LENG QINGSONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Low-temperature soldering flux of photovoltaic soldering strip for HIT heterojunction and preparation method</title><date>2019-12-10</date><risdate>2019</risdate><abstract>The invention relates to a low-temperature soldering flux of a photovoltaic soldering strip for a HIT heterojunction and a preparation method. The low-temperature soldering flux is prepared from the following raw materials including, by mass, 35% - 40% of bismuth, 1.5%-2.5% of silver powder, 0.01% - 0.02% of copper and the balance tin. The low-temperature soldering flux adopts spherical silver powder and other conductive materials which are identical with conductive materials of battery piece grid line silver paste, the ingredients and the form particle size levels are within the same specification range, even under a low-temperature soldering condition, the materials are promoted to undergo eutectic transformation, so that a formed electrode interference metal intermediate compound is more uniform and denser, conductive phase network contact is more complete, and therefore the conductivity, the adhesion force (namely soldering tension force) and reliability (namely TC200 and DH1000) of the silver electrode a</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN110549030A |
source | esp@cenet |
subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
title | Low-temperature soldering flux of photovoltaic soldering strip for HIT heterojunction and preparation method |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T07%3A12%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GENG%20XINTONG&rft.date=2019-12-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN110549030A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |