Single-chip wafer wet etching equipment and method

The invention discloses single-chip wafer wet etching equipment. The equipment comprises an etching liquid spraying device, a robot arm, and a backside temperature control device. The robot arm is used for wafer picking and placing. The etching liquid spraying device has a nozzle, and the nozzle is used to inject an etching liquid into a front surface of a wafer during wet etching of the wafer. The etching liquid is used to etch the etched material on a front side of the wafer, and an etching rate has temperature sensitivity. The backside temperature control device is used to carry out temperature control from the back side of the wafer during the wet etching of the wafer so that a temperature of each region of the wafer is uniform and stable, and etching uniformity is improved. The invention also discloses a single-chip wafer wet etching method. In the invention, uniformity of the wet etching can be increased, damages of etching to a wafer surface is reduced, the uniformity of the wetetching can be improved