SLURRY-BASED METHODS FOR FORMING A BOND COAT AND ARTICLES FORMED BY THE METHODS

Methods for forming a sintered bond coat (64) on a silicon-based substrate (14) and articles (50) formed by the methods are disclosed. The methods include applying a bond coat slurry on the silicon-based substrate (14), drying the bond coat slurry on the silicon-based substrate to form a dried bond...

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Bibliographische Detailangaben
Hauptverfasser: SAHA ATANU, MANEPALLI SATYA K, ANTOLINO NICHOLAS E, LIPKIN DON M
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Methods for forming a sintered bond coat (64) on a silicon-based substrate (14) and articles (50) formed by the methods are disclosed. The methods include applying a bond coat slurry on the silicon-based substrate (14), drying the bond coat slurry on the silicon-based substrate to form a dried bond coat (44), and sintering the dried bond coat (44) in an oxidizing atmosphere to form a sintered bondcoat (64) on the silicon-based substrate (14). The bond coat slurry includes a bond coat patching material in a bond coat fluid carrier. The articles (50) include a silicon-based substrate (14), a sintered bond coat (64) formed on the silicon-based substrate (14), and a sintered environmental barrier coating (EBC) (66) formed on the sintered bond coat (64). The sintered bond coat (64) includes asilicon-based phase and an oxide of the silicon-based phase. 本文公开了用于在硅基衬底(14)上形成烧结粘合涂层(64)的方法和由该方法形成的制品(50)。该方法包括:在硅基衬底(14)上涂覆粘合涂层浆料,干燥硅基衬底上的粘合涂层浆料,形成干粘合涂层(44),以及在氧化气氛中烧结该干粘合涂层(44),在硅基衬底(14)上形成烧结粘合涂层(64)。粘合涂层浆料包含粘合涂层流体载体中的粘合涂层