Resin composition for circuit board, and metal-base circuit board using same
Provided are: a metal-base circuit board having exceptional solder crack resistance, thermal conductivity, adhesiveness, and insulating properties; and a resin composition for a circuit board used for the metal-base circuit board. The resin composition for a circuit board containing: a vinylsilyl-gr...
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| creator | KOGURE KATSUMICHI YASHIMA KATSUNORI SUYAMA IKUO KIMOTO YUKI NISHI TAIKI |
| description | Provided are: a metal-base circuit board having exceptional solder crack resistance, thermal conductivity, adhesiveness, and insulating properties; and a resin composition for a circuit board used for the metal-base circuit board. The resin composition for a circuit board containing: a vinylsilyl-group-containing polysiloxane (vinylsilyl group equivalent: 0.005-0.045 mol/kg) including (A) a double-terminal vinylsilyl-group-containing polysiloxane having a weight-average molecular weight of 30000-80000, and (B) a side-chain double-terminal vinylsilyl-group-containing polysiloxane having a weight-average molecular weight of 100,000 or greater; a hydrosilyl-group-containing polysiloxane (hydrosilyl group equivalent: 6 mol/kg or greater); and 60-80 vol% of an inorganic filler. The mass ratio of (A) to (B) ((A)/(B)) is 80/20 to 30/70, and the molar ratio of (C) hydrosilyl groups to (D) vinylsilyl groups ((C)/(D)) is 2.5-5.0.
本发明提供耐焊料裂纹性、导热性、粘接性及绝缘性优异的金属基底电路基板及该金属基底电路基板中使用的电路基板用树脂组合物。电路基板用树脂组合物，其含有含乙烯基甲硅烷基的聚硅氧烷(乙烯基 |
| format | Patent |
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本发明提供耐焊料裂纹性、导热性、粘接性及绝缘性优异的金属基底电路基板及该金属基底电路基板中使用的电路基板用树脂组合物。电路基板用树脂组合物，其含有含乙烯基甲硅烷基的聚硅氧烷(乙烯基</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190927&DB=EPODOC&CC=CN&NR=110291848A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190927&DB=EPODOC&CC=CN&NR=110291848A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOGURE KATSUMICHI</creatorcontrib><creatorcontrib>YASHIMA KATSUNORI</creatorcontrib><creatorcontrib>SUYAMA IKUO</creatorcontrib><creatorcontrib>KIMOTO YUKI</creatorcontrib><creatorcontrib>NISHI TAIKI</creatorcontrib><title>Resin composition for circuit board, and metal-base circuit board using same</title><description>Provided are: a metal-base circuit board having exceptional solder crack resistance, thermal conductivity, adhesiveness, and insulating properties; and a resin composition for a circuit board used for the metal-base circuit board. The resin composition for a circuit board containing: a vinylsilyl-group-containing polysiloxane (vinylsilyl group equivalent: 0.005-0.045 mol/kg) including (A) a double-terminal vinylsilyl-group-containing polysiloxane having a weight-average molecular weight of 30000-80000, and (B) a side-chain double-terminal vinylsilyl-group-containing polysiloxane having a weight-average molecular weight of 100,000 or greater; a hydrosilyl-group-containing polysiloxane (hydrosilyl group equivalent: 6 mol/kg or greater); and 60-80 vol% of an inorganic filler. The mass ratio of (A) to (B) ((A)/(B)) is 80/20 to 30/70, and the molar ratio of (C) hydrosilyl groups to (D) vinylsilyl groups ((C)/(D)) is 2.5-5.0.
本发明提供耐焊料裂纹性、导热性、粘接性及绝缘性优异的金属基底电路基板及该金属基底电路基板中使用的电路基板用树脂组合物。电路基板用树脂组合物，其含有含乙烯基甲硅烷基的聚硅氧烷(乙烯基</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAJSi3OzFNIzs8tyC_OLMnMz1NIyy9SSM4sSi7NLFFIyk8sStFRSMxLUchNLUnM0U1KLE5FlVUoBRqQrlCcmJvKw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkvinf0MDQ2MLA0tTCwcjYlRAwB0ejVv</recordid><startdate>20190927</startdate><enddate>20190927</enddate><creator>KOGURE KATSUMICHI</creator><creator>YASHIMA KATSUNORI</creator><creator>SUYAMA IKUO</creator><creator>KIMOTO YUKI</creator><creator>NISHI TAIKI</creator><scope>EVB</scope></search><sort><creationdate>20190927</creationdate><title>Resin composition for circuit board, and metal-base circuit board using same</title><author>KOGURE KATSUMICHI ; YASHIMA KATSUNORI ; SUYAMA IKUO ; KIMOTO YUKI ; NISHI TAIKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110291848A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>KOGURE KATSUMICHI</creatorcontrib><creatorcontrib>YASHIMA KATSUNORI</creatorcontrib><creatorcontrib>SUYAMA IKUO</creatorcontrib><creatorcontrib>KIMOTO YUKI</creatorcontrib><creatorcontrib>NISHI TAIKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOGURE KATSUMICHI</au><au>YASHIMA KATSUNORI</au><au>SUYAMA IKUO</au><au>KIMOTO YUKI</au><au>NISHI TAIKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Resin composition for circuit board, and metal-base circuit board using same</title><date>2019-09-27</date><risdate>2019</risdate><abstract>Provided are: a metal-base circuit board having exceptional solder crack resistance, thermal conductivity, adhesiveness, and insulating properties; and a resin composition for a circuit board used for the metal-base circuit board. The resin composition for a circuit board containing: a vinylsilyl-group-containing polysiloxane (vinylsilyl group equivalent: 0.005-0.045 mol/kg) including (A) a double-terminal vinylsilyl-group-containing polysiloxane having a weight-average molecular weight of 30000-80000, and (B) a side-chain double-terminal vinylsilyl-group-containing polysiloxane having a weight-average molecular weight of 100,000 or greater; a hydrosilyl-group-containing polysiloxane (hydrosilyl group equivalent: 6 mol/kg or greater); and 60-80 vol% of an inorganic filler. The mass ratio of (A) to (B) ((A)/(B)) is 80/20 to 30/70, and the molar ratio of (C) hydrosilyl groups to (D) vinylsilyl groups ((C)/(D)) is 2.5-5.0.
本发明提供耐焊料裂纹性、导热性、粘接性及绝缘性优异的金属基底电路基板及该金属基底电路基板中使用的电路基板用树脂组合物。电路基板用树脂组合物，其含有含乙烯基甲硅烷基的聚硅氧烷(乙烯基</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | Resin composition for circuit board, and metal-base circuit board using same |
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