Full-caliber thin film deposition clamp
The invention discloses a full-caliber thin film deposition clamp, and relates to the technical field of tool clamps. The full-caliber thin film deposition clamp is used for solving the technical problem that the surface quality of a plated film in the prior art is poor. The full-caliber thin film d...
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| creator | ZHAO ZUZHEN SUN BINGMEI SHEN YANG LIU HAO |
| description | The invention discloses a full-caliber thin film deposition clamp, and relates to the technical field of tool clamps. The full-caliber thin film deposition clamp is used for solving the technical problem that the surface quality of a plated film in the prior art is poor. The full-caliber thin film deposition clamp comprises a first fixing seat, a second fixing seat and an adjusting rod, the first fixed seat is provided with a first through hole, the second fixed seat is provided with a second through hole, the first fixing seat is connected with the second fixing seat, and the adjusting rod is arranged in the second through hole. The first through hole is used for containing a to-be-machined part, and the to-be-machined part is fixed by the adjusting rod. Therefore, the to-be-machined part is clamped through the first fixing seat, the second fixing seat and the adjusting rod so that full-caliber thin film deposition of the bottom surface of the to-be-machined part can be realized, thin film deposition on the |
| format | Patent |
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The full-caliber thin film deposition clamp is used for solving the technical problem that the surface quality of a plated film in the prior art is poor. The full-caliber thin film deposition clamp comprises a first fixing seat, a second fixing seat and an adjusting rod, the first fixed seat is provided with a first through hole, the second fixed seat is provided with a second through hole, the first fixing seat is connected with the second fixing seat, and the adjusting rod is arranged in the second through hole. The first through hole is used for containing a to-be-machined part, and the to-be-machined part is fixed by the adjusting rod. Therefore, the to-be-machined part is clamped through the first fixing seat, the second fixing seat and the adjusting rod so that full-caliber thin film deposition of the bottom surface of the to-be-machined part can be realized, thin film deposition on the</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190924&DB=EPODOC&CC=CN&NR=110273134A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190924&DB=EPODOC&CC=CN&NR=110273134A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHAO ZUZHEN</creatorcontrib><creatorcontrib>SUN BINGMEI</creatorcontrib><creatorcontrib>SHEN YANG</creatorcontrib><creatorcontrib>LIU HAO</creatorcontrib><title>Full-caliber thin film deposition clamp</title><description>The invention discloses a full-caliber thin film deposition clamp, and relates to the technical field of tool clamps. The full-caliber thin film deposition clamp is used for solving the technical problem that the surface quality of a plated film in the prior art is poor. The full-caliber thin film deposition clamp comprises a first fixing seat, a second fixing seat and an adjusting rod, the first fixed seat is provided with a first through hole, the second fixed seat is provided with a second through hole, the first fixing seat is connected with the second fixing seat, and the adjusting rod is arranged in the second through hole. The first through hole is used for containing a to-be-machined part, and the to-be-machined part is fixed by the adjusting rod. Therefore, the to-be-machined part is clamped through the first fixing seat, the second fixing seat and the adjusting rod so that full-caliber thin film deposition of the bottom surface of the to-be-machined part can be realized, thin film deposition on the</description><subject>APPARATUS THEREFOR</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB3K83J0U1OzMlMSi1SKMnIzFNIy8zJVUhJLcgvzizJzM9TSM5JzC3gYWBNS8wpTuWF0twMim6uIc4eukB18anFBYnJqXmpJfHOfoaGBkbmxobGJo7GxKgBAIr-J7I</recordid><startdate>20190924</startdate><enddate>20190924</enddate><creator>ZHAO ZUZHEN</creator><creator>SUN BINGMEI</creator><creator>SHEN YANG</creator><creator>LIU HAO</creator><scope>EVB</scope></search><sort><creationdate>20190924</creationdate><title>Full-caliber thin film deposition clamp</title><author>ZHAO ZUZHEN ; SUN BINGMEI ; SHEN YANG ; LIU HAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110273134A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHAO ZUZHEN</creatorcontrib><creatorcontrib>SUN BINGMEI</creatorcontrib><creatorcontrib>SHEN YANG</creatorcontrib><creatorcontrib>LIU HAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHAO ZUZHEN</au><au>SUN BINGMEI</au><au>SHEN YANG</au><au>LIU HAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Full-caliber thin film deposition clamp</title><date>2019-09-24</date><risdate>2019</risdate><abstract>The invention discloses a full-caliber thin film deposition clamp, and relates to the technical field of tool clamps. 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| language | chi ; eng |
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| subjects | APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Full-caliber thin film deposition clamp |
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