LEAD FRAME SURFACE FINISHING

The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adh...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NEOH DIN-GHEE, CREMA PAOLO, BARTHELMES JURGEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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