Cleaning-free flame-retardant soldering flux and preparation method thereof
The invention discloses a cleaning-free flame-retardant soldering flux and a preparation method thereof. The cleaning-free flame-retardant soldering flux is prepared from the following raw materials of, in percentage by weight, 0.3%-1% of succinic acid, 0.3%-1% of adipic acid, 0.1%-1% of malic acid,...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LI TAOLING |
| description | The invention discloses a cleaning-free flame-retardant soldering flux and a preparation method thereof. The cleaning-free flame-retardant soldering flux is prepared from the following raw materials of, in percentage by weight, 0.3%-1% of succinic acid, 0.3%-1% of adipic acid, 0.1%-1% of malic acid, 0.05%-0.7% of alkylphenol polyoxyethylene, 0.8%-2% of rosin, 0.2%-1% of terpineol, 5%-12% of methanol, 1%-5% of dimethyl methylphosphonate and the balance solvent. The cleaning-free flame-retardant soldering flux is colorless and transparent and does not have pungent smell, the surface of a soldered circuit board looks clean, cleaning is not needed, the wettability is good, non-flammable and non-explosive effects can be realized, the expansion rate is larger than 85%, the insulation resistance generated after soldering is larger than 4*10 ohm, the ion pollution degree is smaller than 0.1 micro gramme NaCl/cm , and the corrosivity and the drying degree are qualified.
本发明公开了一种免清洗阻燃助焊剂及其制备方法。该免清洗阻燃助焊剂由下述按照重量百分比计的原料制成 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN110238561A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN110238561A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN110238561A3</originalsourceid><addsrcrecordid>eNqNyjEKAjEQRuFtLES9w3iAgHFRtpWgCIKV_TKYP-5CdhImETy-W3gAq1d8b9ncXATLKC8TFKAQeYJRVFbPUqmk6KEzz_L-EIunrMisXMckNKEOyVMdoEhh3SwCx4LNr6tmezk_3NUgpx4l8xOC2ru7tbt92x2O9tT-83wBf-Q1uw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Cleaning-free flame-retardant soldering flux and preparation method thereof</title><source>esp@cenet</source><creator>LI TAOLING</creator><creatorcontrib>LI TAOLING</creatorcontrib><description>The invention discloses a cleaning-free flame-retardant soldering flux and a preparation method thereof. The cleaning-free flame-retardant soldering flux is prepared from the following raw materials of, in percentage by weight, 0.3%-1% of succinic acid, 0.3%-1% of adipic acid, 0.1%-1% of malic acid, 0.05%-0.7% of alkylphenol polyoxyethylene, 0.8%-2% of rosin, 0.2%-1% of terpineol, 5%-12% of methanol, 1%-5% of dimethyl methylphosphonate and the balance solvent. The cleaning-free flame-retardant soldering flux is colorless and transparent and does not have pungent smell, the surface of a soldered circuit board looks clean, cleaning is not needed, the wettability is good, non-flammable and non-explosive effects can be realized, the expansion rate is larger than 85%, the insulation resistance generated after soldering is larger than 4*10 ohm, the ion pollution degree is smaller than 0.1 micro gramme NaCl/cm , and the corrosivity and the drying degree are qualified.
本发明公开了一种免清洗阻燃助焊剂及其制备方法。该免清洗阻燃助焊剂由下述按照重量百分比计的原料制成</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190917&DB=EPODOC&CC=CN&NR=110238561A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190917&DB=EPODOC&CC=CN&NR=110238561A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI TAOLING</creatorcontrib><title>Cleaning-free flame-retardant soldering flux and preparation method thereof</title><description>The invention discloses a cleaning-free flame-retardant soldering flux and a preparation method thereof. The cleaning-free flame-retardant soldering flux is prepared from the following raw materials of, in percentage by weight, 0.3%-1% of succinic acid, 0.3%-1% of adipic acid, 0.1%-1% of malic acid, 0.05%-0.7% of alkylphenol polyoxyethylene, 0.8%-2% of rosin, 0.2%-1% of terpineol, 5%-12% of methanol, 1%-5% of dimethyl methylphosphonate and the balance solvent. The cleaning-free flame-retardant soldering flux is colorless and transparent and does not have pungent smell, the surface of a soldered circuit board looks clean, cleaning is not needed, the wettability is good, non-flammable and non-explosive effects can be realized, the expansion rate is larger than 85%, the insulation resistance generated after soldering is larger than 4*10 ohm, the ion pollution degree is smaller than 0.1 micro gramme NaCl/cm , and the corrosivity and the drying degree are qualified.
本发明公开了一种免清洗阻燃助焊剂及其制备方法。该免清洗阻燃助焊剂由下述按照重量百分比计的原料制成</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEKAjEQRuFtLES9w3iAgHFRtpWgCIKV_TKYP-5CdhImETy-W3gAq1d8b9ncXATLKC8TFKAQeYJRVFbPUqmk6KEzz_L-EIunrMisXMckNKEOyVMdoEhh3SwCx4LNr6tmezk_3NUgpx4l8xOC2ru7tbt92x2O9tT-83wBf-Q1uw</recordid><startdate>20190917</startdate><enddate>20190917</enddate><creator>LI TAOLING</creator><scope>EVB</scope></search><sort><creationdate>20190917</creationdate><title>Cleaning-free flame-retardant soldering flux and preparation method thereof</title><author>LI TAOLING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110238561A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>LI TAOLING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI TAOLING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cleaning-free flame-retardant soldering flux and preparation method thereof</title><date>2019-09-17</date><risdate>2019</risdate><abstract>The invention discloses a cleaning-free flame-retardant soldering flux and a preparation method thereof. The cleaning-free flame-retardant soldering flux is prepared from the following raw materials of, in percentage by weight, 0.3%-1% of succinic acid, 0.3%-1% of adipic acid, 0.1%-1% of malic acid, 0.05%-0.7% of alkylphenol polyoxyethylene, 0.8%-2% of rosin, 0.2%-1% of terpineol, 5%-12% of methanol, 1%-5% of dimethyl methylphosphonate and the balance solvent. The cleaning-free flame-retardant soldering flux is colorless and transparent and does not have pungent smell, the surface of a soldered circuit board looks clean, cleaning is not needed, the wettability is good, non-flammable and non-explosive effects can be realized, the expansion rate is larger than 85%, the insulation resistance generated after soldering is larger than 4*10 ohm, the ion pollution degree is smaller than 0.1 micro gramme NaCl/cm , and the corrosivity and the drying degree are qualified.
本发明公开了一种免清洗阻燃助焊剂及其制备方法。该免清洗阻燃助焊剂由下述按照重量百分比计的原料制成</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN110238561A |
| source | esp@cenet |
| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Cleaning-free flame-retardant soldering flux and preparation method thereof |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T03%3A29%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LI%20TAOLING&rft.date=2019-09-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN110238561A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |