COATING METHOD, COATING APPARATUS AND METHOD OF MANUFACTURING COMPONENT

The present disclosure provides a coating method for suppressing variations in a coating amount, a coating apparatus and a method for manufacturing a component. A coating method is employed, which includes: discharging a coating needle adhering to an adhesive from a nozzle; separating the adhesive i...

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Hauptverfasser: ITOU MITSUMI, EBIHARA HIROSHI
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EBIHARA HIROSHI
description The present disclosure provides a coating method for suppressing variations in a coating amount, a coating apparatus and a method for manufacturing a component. A coating method is employed, which includes: discharging a coating needle adhering to an adhesive from a nozzle; separating the adhesive into the tip of the coating needle and the nozzle; and adhering the adhesive to a first member. A coating apparatus is employed, which includes: a nozzle which holds the adhesive; a coating needle which is discharged from the nozzle in a state where the adhesive is adhered to the tip; and a control unit which controls moving speed of the coating needle to separate the adhesive into the tip of the coating needle and the nozzle. 本发明提供一种抑制涂敷量波动的涂敷方法、涂敷装置以及部件的制造方法。涂敷方法包括:从喷嘴将附着有粘合材料的涂敷针伸出的排出工序;将所述粘合材料分离至所述涂敷针的顶端和所述喷嘴的分离工序;以及使所述粘合材料附着于第一零件的附着工序。涂敷装置具有:喷嘴,其保持粘合材料;涂敷针,其在顶端附着有所述粘合材料的状态下从所述喷嘴排出;以及控制部,其控制所述涂敷针的移动速度,而进行将所述顶端的粘合材料分离至所述涂敷针的顶端和所述喷嘴的控制。
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subjects APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SEMICONDUCTOR DEVICES
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title COATING METHOD, COATING APPARATUS AND METHOD OF MANUFACTURING COMPONENT
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