DEVICES WITH MOUNTED COMPONENTS

Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat mayalso distort the surface substrate material, which may become brittle from accumulated thermal stres...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOLENO BRIAN JOSEPH, NIKKHOO MICHAEL, HURBI ERIN ELIZABETH, MARKOVSKY IGOR
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
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