SEMICONDUCTOR DEVICE
The present invention is characterized by including: a heat sink; an integrated component which is fixed to the heat sink and integrates a matching circuit and a ceramic terminal having a microstrip line; a lead fixed to the ceramic terminal; an integrated substrate fixed to the heat sink; a semicon...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ICHINOHE HIROAKI ITO MASAYASU TSURUMAKI TAKASHI MIYAWAKI KATSUMI |
| description | The present invention is characterized by including: a heat sink; an integrated component which is fixed to the heat sink and integrates a matching circuit and a ceramic terminal having a microstrip line; a lead fixed to the ceramic terminal; an integrated substrate fixed to the heat sink; a semiconductor chip fixed to the heat sink; a plurality of wires connecting the matching circuit and the integrated substrate and electrically connecting the integrated substrate and the semiconductor chip; a frame surrounding the integrated substrate and the semiconductor chip in plan view; and a cap provided on the frame.
特征在于，具备：散热器；一体化部件，其使匹配电路和具有微带线的陶瓷端子进行了一体化，一体化部件固定于该散热器；引线，其固定于该陶瓷端子；匹配基板，其固定于该散热器；半导体芯片，其固定于该散热器；多根导线，其将该匹配电路和该匹配基板连接，将该匹配基板和该半导体芯片电连接；框架，其在俯视时包围该匹配基板和该半导体芯片；以及盖，其设置于该框架之上。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN110140205A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN110140205A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN110140205A3</originalsourceid><addsrcrecordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGBoYmBkYGpo7GxKgBAH1gHoY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>ICHINOHE HIROAKI ; ITO MASAYASU ; TSURUMAKI TAKASHI ; MIYAWAKI KATSUMI</creator><creatorcontrib>ICHINOHE HIROAKI ; ITO MASAYASU ; TSURUMAKI TAKASHI ; MIYAWAKI KATSUMI</creatorcontrib><description>The present invention is characterized by including: a heat sink; an integrated component which is fixed to the heat sink and integrates a matching circuit and a ceramic terminal having a microstrip line; a lead fixed to the ceramic terminal; an integrated substrate fixed to the heat sink; a semiconductor chip fixed to the heat sink; a plurality of wires connecting the matching circuit and the integrated substrate and electrically connecting the integrated substrate and the semiconductor chip; a frame surrounding the integrated substrate and the semiconductor chip in plan view; and a cap provided on the frame.
特征在于，具备：散热器；一体化部件，其使匹配电路和具有微带线的陶瓷端子进行了一体化，一体化部件固定于该散热器；引线，其固定于该陶瓷端子；匹配基板，其固定于该散热器；半导体芯片，其固定于该散热器；多根导线，其将该匹配电路和该匹配基板连接，将该匹配基板和该半导体芯片电连接；框架，其在俯视时包围该匹配基板和该半导体芯片；以及盖，其设置于该框架之上。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190816&DB=EPODOC&CC=CN&NR=110140205A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190816&DB=EPODOC&CC=CN&NR=110140205A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ICHINOHE HIROAKI</creatorcontrib><creatorcontrib>ITO MASAYASU</creatorcontrib><creatorcontrib>TSURUMAKI TAKASHI</creatorcontrib><creatorcontrib>MIYAWAKI KATSUMI</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>The present invention is characterized by including: a heat sink; an integrated component which is fixed to the heat sink and integrates a matching circuit and a ceramic terminal having a microstrip line; a lead fixed to the ceramic terminal; an integrated substrate fixed to the heat sink; a semiconductor chip fixed to the heat sink; a plurality of wires connecting the matching circuit and the integrated substrate and electrically connecting the integrated substrate and the semiconductor chip; a frame surrounding the integrated substrate and the semiconductor chip in plan view; and a cap provided on the frame.
特征在于，具备：散热器；一体化部件，其使匹配电路和具有微带线的陶瓷端子进行了一体化，一体化部件固定于该散热器；引线，其固定于该陶瓷端子；匹配基板，其固定于该散热器；半导体芯片，其固定于该散热器；多根导线，其将该匹配电路和该匹配基板连接，将该匹配基板和该半导体芯片电连接；框架，其在俯视时包围该匹配基板和该半导体芯片；以及盖，其设置于该框架之上。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGBoYmBkYGpo7GxKgBAH1gHoY</recordid><startdate>20190816</startdate><enddate>20190816</enddate><creator>ICHINOHE HIROAKI</creator><creator>ITO MASAYASU</creator><creator>TSURUMAKI TAKASHI</creator><creator>MIYAWAKI KATSUMI</creator><scope>EVB</scope></search><sort><creationdate>20190816</creationdate><title>SEMICONDUCTOR DEVICE</title><author>ICHINOHE HIROAKI ; ITO MASAYASU ; TSURUMAKI TAKASHI ; MIYAWAKI KATSUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110140205A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ICHINOHE HIROAKI</creatorcontrib><creatorcontrib>ITO MASAYASU</creatorcontrib><creatorcontrib>TSURUMAKI TAKASHI</creatorcontrib><creatorcontrib>MIYAWAKI KATSUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ICHINOHE HIROAKI</au><au>ITO MASAYASU</au><au>TSURUMAKI TAKASHI</au><au>MIYAWAKI KATSUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>2019-08-16</date><risdate>2019</risdate><abstract>The present invention is characterized by including: a heat sink; an integrated component which is fixed to the heat sink and integrates a matching circuit and a ceramic terminal having a microstrip line; a lead fixed to the ceramic terminal; an integrated substrate fixed to the heat sink; a semiconductor chip fixed to the heat sink; a plurality of wires connecting the matching circuit and the integrated substrate and electrically connecting the integrated substrate and the semiconductor chip; a frame surrounding the integrated substrate and the semiconductor chip in plan view; and a cap provided on the frame.
特征在于，具备：散热器；一体化部件，其使匹配电路和具有微带线的陶瓷端子进行了一体化，一体化部件固定于该散热器；引线，其固定于该陶瓷端子；匹配基板，其固定于该散热器；半导体芯片，其固定于该散热器；多根导线，其将该匹配电路和该匹配基板连接，将该匹配基板和该半导体芯片电连接；框架，其在俯视时包围该匹配基板和该半导体芯片；以及盖，其设置于该框架之上。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN110140205A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T13%3A48%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ICHINOHE%20HIROAKI&rft.date=2019-08-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN110140205A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |