Laser machining device and method for machining workpiece by using laser machining device

The invention relates to a laser machining device and a method for machining a workpiece by using the laser machining device. The laser machining device (10) has a laser (11) for generating a laser beam (12), which is diverted by way of a diverting device (15) in accordance with a pattern defined by a control unit (14) and is directed onto a workpiece surface (17) to be machined of a workpiece (13). The point of impingement (18) of the diverted laser beam (12b) on the workpiece surface is guided along at least one spiral path within a circular hatched area. The spiral path is characterized byspiral path parameters. One spiral path parameter is the line spacing (a) between neighbouring points of intersection of the spiral path with an axis running through the centre point of the spiral path. 本发明涉及用于利用激光加工设备加工工件的方法和激光加工设备。激光加工设备（10）具有用于产生激光束（12）的激光器（11），所述激光束经由偏转装置（15）根据通过控制单元（14）预先给定的图形偏转并且定向到工件（13）的要加工的工件表面（17）上。偏转的激光束（12b）在工件表面上的射中位置（18）在圆形的阴影面之内沿着至少一个螺旋轨道引导。螺旋轨道的特征在于螺旋轨道参数。螺旋轨道参数是螺旋轨道与伸展经过螺旋轨道的中心的轴的相邻的交点之间的