Method of attaching lens to LED module with high alignment accuracy
A light emitting device includes a light emitting element on a substrate, and a lens element that includes a cavity within which the light emitting element is situated, and is optically aligned with the light emitting element. A strip of adhesive that attaches the lens element to the substrate subst...
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| creator | LEONG CHEE MUN FOONG LI LIAN LAW RUEN CHING TIONG KWONG HO |
| description | A light emitting device includes a light emitting element on a substrate, and a lens element that includes a cavity within which the light emitting element is situated, and is optically aligned with the light emitting element. A strip of adhesive that attaches the lens element to the substrate substantially surrounds the light emitting element, but includes a gap that facilitates release of material from the cavity during the attachment of the lens element to the substrate. When the lens element is placed upon the substrate, the adhesive is partially cured to provide a relatively high shear strength before the light emitting device is transported or subjected to other processes. To provide compatibility with subsequent processes or applications, and to protect the light emitting element from the environment, the gap in each device is sealed with a sealing material.
发光设备包括在基板上的发光元件以及透镜元件，透镜元件包括腔（发光元件位于腔中）并且与发光元件光学对准。将透镜元件附着到基板的粘合剂条基本上围绕发光元件，但是包括在透镜元件到基板的附着期间促进材料从腔的释放的间隙。当透镜元件被放置在基板上时，粘合剂被部分固化以在发光设备被输送或受到其他处理之前 |
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发光设备包括在基板上的发光元件以及透镜元件，透镜元件包括腔（发光元件位于腔中）并且与发光元件光学对准。将透镜元件附着到基板的粘合剂条基本上围绕发光元件，但是包括在透镜元件到基板的附着期间促进材料从腔的释放的间隙。当透镜元件被放置在基板上时，粘合剂被部分固化以在发光设备被输送或受到其他处理之前</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; WEAPONS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190723&DB=EPODOC&CC=CN&NR=110047987A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190723&DB=EPODOC&CC=CN&NR=110047987A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEONG CHEE MUN</creatorcontrib><creatorcontrib>FOONG LI LIAN</creatorcontrib><creatorcontrib>LAW RUEN CHING</creatorcontrib><creatorcontrib>TIONG KWONG HO</creatorcontrib><title>Method of attaching lens to LED module with high alignment accuracy</title><description>A light emitting device includes a light emitting element on a substrate, and a lens element that includes a cavity within which the light emitting element is situated, and is optically aligned with the light emitting element. A strip of adhesive that attaches the lens element to the substrate substantially surrounds the light emitting element, but includes a gap that facilitates release of material from the cavity during the attachment of the lens element to the substrate. When the lens element is placed upon the substrate, the adhesive is partially cured to provide a relatively high shear strength before the light emitting device is transported or subjected to other processes. To provide compatibility with subsequent processes or applications, and to protect the light emitting element from the environment, the gap in each device is sealed with a sealing material.
发光设备包括在基板上的发光元件以及透镜元件，透镜元件包括腔（发光元件位于腔中）并且与发光元件光学对准。将透镜元件附着到基板的粘合剂条基本上围绕发光元件，但是包括在透镜元件到基板的附着期间促进材料从腔的释放的间隙。当透镜元件被放置在基板上时，粘合剂被部分固化以在发光设备被输送或受到其他处理之前</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD2TS3JyE9RyE9TSCwpSUzOyMxLV8hJzStWKMlX8HF1UcjNTynNSVUozyzJUMjITM9QSMzJTM_LTc0rUUhMTi4tSkyu5GFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYGBibmlhbmjsbEqAEAEuAxsw</recordid><startdate>20190723</startdate><enddate>20190723</enddate><creator>LEONG CHEE MUN</creator><creator>FOONG LI LIAN</creator><creator>LAW RUEN CHING</creator><creator>TIONG KWONG HO</creator><scope>EVB</scope></search><sort><creationdate>20190723</creationdate><title>Method of attaching lens to LED module with high alignment accuracy</title><author>LEONG CHEE MUN ; FOONG LI LIAN ; LAW RUEN CHING ; TIONG KWONG HO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110047987A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>LEONG CHEE MUN</creatorcontrib><creatorcontrib>FOONG LI LIAN</creatorcontrib><creatorcontrib>LAW RUEN CHING</creatorcontrib><creatorcontrib>TIONG KWONG HO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEONG CHEE MUN</au><au>FOONG LI LIAN</au><au>LAW RUEN CHING</au><au>TIONG KWONG HO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of attaching lens to LED module with high alignment accuracy</title><date>2019-07-23</date><risdate>2019</risdate><abstract>A light emitting device includes a light emitting element on a substrate, and a lens element that includes a cavity within which the light emitting element is situated, and is optically aligned with the light emitting element. A strip of adhesive that attaches the lens element to the substrate substantially surrounds the light emitting element, but includes a gap that facilitates release of material from the cavity during the attachment of the lens element to the substrate. When the lens element is placed upon the substrate, the adhesive is partially cured to provide a relatively high shear strength before the light emitting device is transported or subjected to other processes. To provide compatibility with subsequent processes or applications, and to protect the light emitting element from the environment, the gap in each device is sealed with a sealing material.
发光设备包括在基板上的发光元件以及透镜元件，透镜元件包括腔（发光元件位于腔中）并且与发光元件光学对准。将透镜元件附着到基板的粘合剂条基本上围绕发光元件，但是包括在透镜元件到基板的附着期间促进材料从腔的释放的间隙。当透镜元件被放置在基板上时，粘合剂被部分固化以在发光设备被输送或受到其他处理之前</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS |
| title | Method of attaching lens to LED module with high alignment accuracy |
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