Method for detecting focus variation between wafer center and wafer edge and compensation method thereof
The invention relates to a method for detecting a focus variation between a wafer center and a wafer edge and relates to the integrated circuit manufacturing technology. The method comprises the stepsof (S1) providing a wafer with a plurality of cutting ways, (S2) designing a plurality of pattern an...
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Format: | Patent |
Sprache: | chi ; eng |
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