Semiconductor device including optional pad interconnect

The present invention is entitled a 'semiconductor device including an optional pad interconnect'. The semiconductor device is disclosed including a semiconductor die formed with functionally redundant main and optional die bond pads. In examples, the optional die bond pad is configured to be optionally redundant to the main die bond pad by forming the optional die bond pad with first and second electrically isolated portions, and electrically interconnecting the main die bond pad with the first portion of the second die bond pad. The second die bond pad may or may not be made redundant to thefirst die bond pad depending on whether an electrically conductive material is deposited on the first and second portions of the optional die bond pad. 本发明题为"包括可选垫互连件的半导体装置"。本发明公开了一种半导体装置，该半导体装置包括半导体管芯，该半导体管芯由功能冗余的主管芯接合焊盘和可选管芯接合焊盘形成。在示例中，可选管芯接合焊盘被配置为通过形成具有电隔离的第一部分和第二部分的可选管芯接合焊盘以及将主管芯接合焊盘与第二管芯接合焊盘的第一部分电互连而任选地对主管芯接合焊盘冗余。根据是否将导电材料沉积在可选管芯接合焊盘的第一部分和第二部分上，第二管芯接合焊盘可对或可不对第一管芯接合焊盘冗余。