Method for manufacturing hot insertion application gold fingers

Method for manufacturing hot insertion application gold fingers

The invention discloses a method for manufacturing hot insertion application gold fingers, comprising the following steps: 1) pre-processing of a PCB board, providing a solder mask layer on the PCB board and performing sand blasting treatment; 2) screen printing of anti-plating ink; 3) gold plating...

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1. Verfasser: LIN MUQUN
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Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator LIN MUQUN
description The invention discloses a method for manufacturing hot insertion application gold fingers, comprising the following steps: 1) pre-processing of a PCB board, providing a solder mask layer on the PCB board and performing sand blasting treatment; 2) screen printing of anti-plating ink; 3) gold plating of gold fingers; 4) film removal of the inner layer, fading a wet film formed by the anti-plating ink; and 5) etching of the inner layer. After the wet film formed by the anti-plating ink in the invention is exposed and developed, the Pitch average value between the obtained gold fingers is closer to the design requirement, the standard deviation is smaller from the statistical point of view, that is, the Pitch flatness between the gold fingers is better; in addition, the blue glue in the invention is used, so that the curing time is shorter, and the residual glue rate is lower, the blue glue is filled at an electrogilding gold pinch point after gold plating of the gold fingers is completed,it is ensured that the s
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Method for manufacturing hot insertion application gold fingers
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