A vapor deposition apparatus
The invention provides a vapor deposition apparatus which can reduce the difference between the temperature of a substrate, a vapor deposition mask and the like to be adjusted and a target temperature. At least one of the substrate (W) and the vapor deposition mask (M) is an object to be adjusted in...
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| creator | YANAGIHORI FUMITSUGU YOSHIDA YUICHI |
| description | The invention provides a vapor deposition apparatus which can reduce the difference between the temperature of a substrate, a vapor deposition mask and the like to be adjusted and a target temperature. At least one of the substrate (W) and the vapor deposition mask (M) is an object to be adjusted in temperature, and the vapor deposition apparatus is provided with: a resistance heater (22) that adjusts the temperature of the object to be adjusted in thermal contact with the object to be adjusted; and a temperature adjustment unit (33) that controls the current supplied to the resistance heater(22) on the basis of the temperature of the object to be adjusted. The temperature higher than the temperature of the object to be adjusted when the object to be adjusted is carried into a vacuum tank(16) is the target temperature of the object to be adjusted. The temperature adjustment unit (33) sets the target temperature at which the vapor deposition material is discharged from a vapor deposition source (11) to a tempe |
| format | Patent |
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At least one of the substrate (W) and the vapor deposition mask (M) is an object to be adjusted in temperature, and the vapor deposition apparatus is provided with: a resistance heater (22) that adjusts the temperature of the object to be adjusted in thermal contact with the object to be adjusted; and a temperature adjustment unit (33) that controls the current supplied to the resistance heater(22) on the basis of the temperature of the object to be adjusted. The temperature higher than the temperature of the object to be adjusted when the object to be adjusted is carried into a vacuum tank(16) is the target temperature of the object to be adjusted. The temperature adjustment unit (33) sets the target temperature at which the vapor deposition material is discharged from a vapor deposition source (11) to a tempe</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190618&DB=EPODOC&CC=CN&NR=109898060A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190618&DB=EPODOC&CC=CN&NR=109898060A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANAGIHORI FUMITSUGU</creatorcontrib><creatorcontrib>YOSHIDA YUICHI</creatorcontrib><title>A vapor deposition apparatus</title><description>The invention provides a vapor deposition apparatus which can reduce the difference between the temperature of a substrate, a vapor deposition mask and the like to be adjusted and a target temperature. At least one of the substrate (W) and the vapor deposition mask (M) is an object to be adjusted in temperature, and the vapor deposition apparatus is provided with: a resistance heater (22) that adjusts the temperature of the object to be adjusted in thermal contact with the object to be adjusted; and a temperature adjustment unit (33) that controls the current supplied to the resistance heater(22) on the basis of the temperature of the object to be adjusted. The temperature higher than the temperature of the object to be adjusted when the object to be adjusted is carried into a vacuum tank(16) is the target temperature of the object to be adjusted. The temperature adjustment unit (33) sets the target temperature at which the vapor deposition material is discharged from a vapor deposition source (11) to a tempe</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBxVChLLMgvUkhJLcgvzizJzM9TSCwoSCxKLCkt5mFgTUvMKU7lhdLcDIpuriHOHrpAtfGpxQWJyal5qSXxzn6GBpYWlhYGZgaOxsSoAQCnNiPt</recordid><startdate>20190618</startdate><enddate>20190618</enddate><creator>YANAGIHORI FUMITSUGU</creator><creator>YOSHIDA YUICHI</creator><scope>EVB</scope></search><sort><creationdate>20190618</creationdate><title>A vapor deposition apparatus</title><author>YANAGIHORI FUMITSUGU ; YOSHIDA YUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109898060A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>YANAGIHORI FUMITSUGU</creatorcontrib><creatorcontrib>YOSHIDA YUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANAGIHORI FUMITSUGU</au><au>YOSHIDA YUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A vapor deposition apparatus</title><date>2019-06-18</date><risdate>2019</risdate><abstract>The invention provides a vapor deposition apparatus which can reduce the difference between the temperature of a substrate, a vapor deposition mask and the like to be adjusted and a target temperature. At least one of the substrate (W) and the vapor deposition mask (M) is an object to be adjusted in temperature, and the vapor deposition apparatus is provided with: a resistance heater (22) that adjusts the temperature of the object to be adjusted in thermal contact with the object to be adjusted; and a temperature adjustment unit (33) that controls the current supplied to the resistance heater(22) on the basis of the temperature of the object to be adjusted. The temperature higher than the temperature of the object to be adjusted when the object to be adjusted is carried into a vacuum tank(16) is the target temperature of the object to be adjusted. The temperature adjustment unit (33) sets the target temperature at which the vapor deposition material is discharged from a vapor deposition source (11) to a tempe</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | A vapor deposition apparatus |
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