SEMICONDUCTOR APPARATUS AND ELECTRIC POWER CONVERSION APPARATUS
The invention provides a semiconductor apparatus and an electric power conversion apparatus which can improve the insulating characteristic. The semiconductor apparatus includes a base plate, an adhesive agent provided on an upper face of the base plate, and a casing having a lower face and an incli...
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| creator | KOYANAGI MAKOTO |
| description | The invention provides a semiconductor apparatus and an electric power conversion apparatus which can improve the insulating characteristic. The semiconductor apparatus includes a base plate, an adhesive agent provided on an upper face of the base plate, and a casing having a lower face and an inclined face continuous to the lower face and positioned closer to a center of the base plate than the lower face, and fixed to the base plate through the adhesive agent adhering to the lower face and the inclined face, wherein of the adhesive agent, a portion that is in contact with the inclined face is thicker than a portion thereof that is in contact with the lower face.
本发明的目的在于提供能够提高绝缘特性的半导体装置和电力变换装置。其特征在于，具备：基座板；粘接剂，其设置于该基座板的上表面；以及壳体，其具有下表面、与该下表面相连并且与该下表面相比位于与该基座板的中央接近的位置的斜面，该壳体通过在该下表面和该斜面附着该粘接剂，从而固定于该基座板，该粘接剂中的与该斜面接触的部分比与该下表面接触的部分厚。 |
| format | Patent |
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本发明的目的在于提供能够提高绝缘特性的半导体装置和电力变换装置。其特征在于，具备：基座板；粘接剂，其设置于该基座板的上表面；以及壳体，其具有下表面、与该下表面相连并且与该下表面相比位于与该基座板的中央接近的位置的斜面，该壳体通过在该下表面和该斜面附着该粘接剂，从而固定于该基座板，该粘接剂中的与该斜面接触的部分比与该下表面接触的部分厚。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190604&DB=EPODOC&CC=CN&NR=109841604A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190604&DB=EPODOC&CC=CN&NR=109841604A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOYANAGI MAKOTO</creatorcontrib><title>SEMICONDUCTOR APPARATUS AND ELECTRIC POWER CONVERSION APPARATUS</title><description>The invention provides a semiconductor apparatus and an electric power conversion apparatus which can improve the insulating characteristic. The semiconductor apparatus includes a base plate, an adhesive agent provided on an upper face of the base plate, and a casing having a lower face and an inclined face continuous to the lower face and positioned closer to a center of the base plate than the lower face, and fixed to the base plate through the adhesive agent adhering to the lower face and the inclined face, wherein of the adhesive agent, a portion that is in contact with the inclined face is thicker than a portion thereof that is in contact with the lower face.
本发明的目的在于提供能够提高绝缘特性的半导体装置和电力变换装置。其特征在于，具备：基座板；粘接剂，其设置于该基座板的上表面；以及壳体，其具有下表面、与该下表面相连并且与该下表面相比位于与该基座板的中央接近的位置的斜面，该壳体通过在该下表面和该斜面附着该粘接剂，从而固定于该基座板，该粘接剂中的与该斜面接触的部分比与该下表面接触的部分厚。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPdvX1dPb3cwl1DvEPUnAMCHAMcgwJDVZw9HNRcPVxdQ4J8nRWCPAPdw1SACoLcw0K9vT3Q6jjYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBpYWJoZmBiaOxsSoAQC5Fira</recordid><startdate>20190604</startdate><enddate>20190604</enddate><creator>KOYANAGI MAKOTO</creator><scope>EVB</scope></search><sort><creationdate>20190604</creationdate><title>SEMICONDUCTOR APPARATUS AND ELECTRIC POWER CONVERSION APPARATUS</title><author>KOYANAGI MAKOTO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109841604A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KOYANAGI MAKOTO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOYANAGI MAKOTO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR APPARATUS AND ELECTRIC POWER CONVERSION APPARATUS</title><date>2019-06-04</date><risdate>2019</risdate><abstract>The invention provides a semiconductor apparatus and an electric power conversion apparatus which can improve the insulating characteristic. The semiconductor apparatus includes a base plate, an adhesive agent provided on an upper face of the base plate, and a casing having a lower face and an inclined face continuous to the lower face and positioned closer to a center of the base plate than the lower face, and fixed to the base plate through the adhesive agent adhering to the lower face and the inclined face, wherein of the adhesive agent, a portion that is in contact with the inclined face is thicker than a portion thereof that is in contact with the lower face.
本发明的目的在于提供能够提高绝缘特性的半导体装置和电力变换装置。其特征在于，具备：基座板；粘接剂，其设置于该基座板的上表面；以及壳体，其具有下表面、与该下表面相连并且与该下表面相比位于与该基座板的中央接近的位置的斜面，该壳体通过在该下表面和该斜面附着该粘接剂，从而固定于该基座板，该粘接剂中的与该斜面接触的部分比与该下表面接触的部分厚。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR APPARATUS AND ELECTRIC POWER CONVERSION APPARATUS |
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