Molding system and setting method for same
The invention discloses a molding system and a setting method for same. The molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled witha molding resin from the molding machine, and a computing apparatus connected to the molding machine...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!