Molding system and setting method for same

The invention discloses a molding system and a setting method for same. The molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled witha molding resin from the molding machine, and a computing apparatus connected to the molding machine...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHIEN CHINGANG, CHANG RONG-YEU, CHANG YUING, HSU CHIA-HSIANG, CHANG CHUAN-WEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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