Molding system and setting method for same
The invention discloses a molding system and a setting method for same. The molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled witha molding resin from the molding machine, and a computing apparatus connected to the molding machine...
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| creator | CHIEN CHINGANG CHANG RONG-YEU CHANG YUING HSU CHIA-HSIANG CHANG CHUAN-WEI |
| description | The invention discloses a molding system and a setting method for same. The molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled witha molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile basedon the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.
本公开提供一种成型系统及其设定方法。该成型系统包括一成型机及设置于该成型机的上方的一模具，该模具具有一模穴，经配置以填充来自该成型机 |
| format | Patent |
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本公开提供一种成型系统及其设定方法。该成型系统包括一成型机及设置于该成型机的上方的一模具，该模具具有一模穴，经配置以填充来自该成型机</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190531&DB=EPODOC&CC=CN&NR=109822849A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190531&DB=EPODOC&CC=CN&NR=109822849A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHIEN CHINGANG</creatorcontrib><creatorcontrib>CHANG RONG-YEU</creatorcontrib><creatorcontrib>CHANG YUING</creatorcontrib><creatorcontrib>HSU CHIA-HSIANG</creatorcontrib><creatorcontrib>CHANG CHUAN-WEI</creatorcontrib><title>Molding system and setting method for same</title><description>The invention discloses a molding system and a setting method for same. The molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled witha molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile basedon the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.
本公开提供一种成型系统及其设定方法。该成型系统包括一成型机及设置于该成型机的上方的一模具，该模具具有一模穴，经配置以填充来自该成型机</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDyzc9JycxLVyiuLC5JzVVIzEtRKE4tKQEJ5aaWZOSnKKTlFykUJ-am8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_QwNLCyMjCxNLR2Ni1AAAJR0o9Q</recordid><startdate>20190531</startdate><enddate>20190531</enddate><creator>CHIEN CHINGANG</creator><creator>CHANG RONG-YEU</creator><creator>CHANG YUING</creator><creator>HSU CHIA-HSIANG</creator><creator>CHANG CHUAN-WEI</creator><scope>EVB</scope></search><sort><creationdate>20190531</creationdate><title>Molding system and setting method for same</title><author>CHIEN CHINGANG ; CHANG RONG-YEU ; CHANG YUING ; HSU CHIA-HSIANG ; CHANG CHUAN-WEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109822849A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>CHIEN CHINGANG</creatorcontrib><creatorcontrib>CHANG RONG-YEU</creatorcontrib><creatorcontrib>CHANG YUING</creatorcontrib><creatorcontrib>HSU CHIA-HSIANG</creatorcontrib><creatorcontrib>CHANG CHUAN-WEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHIEN CHINGANG</au><au>CHANG RONG-YEU</au><au>CHANG YUING</au><au>HSU CHIA-HSIANG</au><au>CHANG CHUAN-WEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Molding system and setting method for same</title><date>2019-05-31</date><risdate>2019</risdate><abstract>The invention discloses a molding system and a setting method for same. The molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled witha molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile basedon the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.
本公开提供一种成型系统及其设定方法。该成型系统包括一成型机及设置于该成型机的上方的一模具，该模具具有一模穴，经配置以填充来自该成型机</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Molding system and setting method for same |
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