RESIN COMPOSITION FOR EXTRUSION LAMINATION, MULTILAYER FILM, LID, AND METHOD FOR MANUFACTURING MULTILAYER FILM
Provided is a resin composition for extrusion lamination, the resin composition containing: a high pressure-processed low-density polyethylene; and an ethylene-vinyl acetate copolymer, wherein the resin composition has a melt flow rate of at least 10 g/10 min and less than 30 g/10 min as measured un...
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description | Provided is a resin composition for extrusion lamination, the resin composition containing: a high pressure-processed low-density polyethylene; and an ethylene-vinyl acetate copolymer, wherein the resin composition has a melt flow rate of at least 10 g/10 min and less than 30 g/10 min as measured under conditions of a load of 21.18 N and a temperature of 190 DEG C, has a melt flow rate ratio of atleast 33 and less than 50, and has a molecular weight distribution of at least 3.5 and less than 6.0, and the content of a vinyl acetate-based monomer unit contained in the resin composition is 10-20wt%, with the total weight of resin components contained in the resin composition being 100 wt%.
一种挤出层压用树脂组合物,其含有高压法低密度聚乙烯和乙烯-乙酸乙烯酯共聚物,以载荷21.18N、温度190℃的条件测定的上述树脂组合物的熔体流动速率为10g/10分钟以上且不足30g/10分钟,上述树脂组合物的熔体流动速率比为33以上且不足50,上述树脂组合物的分子量分布为3.5以上且不足6.0,将上述树脂组合物中含有的树脂成分的总重量设为100重量%,上述树脂组合物中含有的基于乙酸乙烯酯的单体单元的含量为10重量%以上且20重量%以下。 |
format | Patent |
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一种挤出层压用树脂组合物,其含有高压法低密度聚乙烯和乙烯-乙酸乙烯酯共聚物,以载荷21.18N、温度190℃的条件测定的上述树脂组合物的熔体流动速率为10g/10分钟以上且不足30g/10分钟,上述树脂组合物的熔体流动速率比为33以上且不足50,上述树脂组合物的分子量分布为3.5以上且不足6.0,将上述树脂组合物中含有的树脂成分的总重量设为100重量%,上述树脂组合物中含有的基于乙酸乙烯酯的单体单元的含量为10重量%以上且20重量%以下。</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190521&DB=EPODOC&CC=CN&NR=109790337A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190521&DB=EPODOC&CC=CN&NR=109790337A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MANAMI TOSHIHIKO</creatorcontrib><title>RESIN COMPOSITION FOR EXTRUSION LAMINATION, MULTILAYER FILM, LID, AND METHOD FOR MANUFACTURING MULTILAYER FILM</title><description>Provided is a resin composition for extrusion lamination, the resin composition containing: a high pressure-processed low-density polyethylene; and an ethylene-vinyl acetate copolymer, wherein the resin composition has a melt flow rate of at least 10 g/10 min and less than 30 g/10 min as measured under conditions of a load of 21.18 N and a temperature of 190 DEG C, has a melt flow rate ratio of atleast 33 and less than 50, and has a molecular weight distribution of at least 3.5 and less than 6.0, and the content of a vinyl acetate-based monomer unit contained in the resin composition is 10-20wt%, with the total weight of resin components contained in the resin composition being 100 wt%.
一种挤出层压用树脂组合物,其含有高压法低密度聚乙烯和乙烯-乙酸乙烯酯共聚物,以载荷21.18N、温度190℃的条件测定的上述树脂组合物的熔体流动速率为10g/10分钟以上且不足30g/10分钟,上述树脂组合物的熔体流动速率比为33以上且不足50,上述树脂组合物的分子量分布为3.5以上且不足6.0,将上述树脂组合物中含有的树脂成分的总重量设为100重量%,上述树脂组合物中含有的基于乙酸乙烯酯的单体单元的含量为10重量%以上且20重量%以下。</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi70KwjAURrs4iPoO171CJUPpeEkTeyG5kfyATqVInKQW6vsjFScnp8PH-c66GL0KxCCdPbtAkRyDdh7UJfoUlmXQEuMiSrDJRDJ4VR40GVuCobYE5Basip1rP6lFThplTJ749Jtsi9V9eMx59-Wm2GsVZXfI07PP8zTc8phfveRj1dRNJUSN4p_PG5NjN4g</recordid><startdate>20190521</startdate><enddate>20190521</enddate><creator>MANAMI TOSHIHIKO</creator><scope>EVB</scope></search><sort><creationdate>20190521</creationdate><title>RESIN COMPOSITION FOR EXTRUSION LAMINATION, MULTILAYER FILM, LID, AND METHOD FOR MANUFACTURING MULTILAYER FILM</title><author>MANAMI TOSHIHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109790337A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>MANAMI TOSHIHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MANAMI TOSHIHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION FOR EXTRUSION LAMINATION, MULTILAYER FILM, LID, AND METHOD FOR MANUFACTURING MULTILAYER FILM</title><date>2019-05-21</date><risdate>2019</risdate><abstract>Provided is a resin composition for extrusion lamination, the resin composition containing: a high pressure-processed low-density polyethylene; and an ethylene-vinyl acetate copolymer, wherein the resin composition has a melt flow rate of at least 10 g/10 min and less than 30 g/10 min as measured under conditions of a load of 21.18 N and a temperature of 190 DEG C, has a melt flow rate ratio of atleast 33 and less than 50, and has a molecular weight distribution of at least 3.5 and less than 6.0, and the content of a vinyl acetate-based monomer unit contained in the resin composition is 10-20wt%, with the total weight of resin components contained in the resin composition being 100 wt%.
一种挤出层压用树脂组合物,其含有高压法低密度聚乙烯和乙烯-乙酸乙烯酯共聚物,以载荷21.18N、温度190℃的条件测定的上述树脂组合物的熔体流动速率为10g/10分钟以上且不足30g/10分钟,上述树脂组合物的熔体流动速率比为33以上且不足50,上述树脂组合物的分子量分布为3.5以上且不足6.0,将上述树脂组合物中含有的树脂成分的总重量设为100重量%,上述树脂组合物中含有的基于乙酸乙烯酯的单体单元的含量为10重量%以上且20重量%以下。</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
title | RESIN COMPOSITION FOR EXTRUSION LAMINATION, MULTILAYER FILM, LID, AND METHOD FOR MANUFACTURING MULTILAYER FILM |
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