Apparatus and method for inspecting multi-layer structure method for fabricating semiconductor device comprising the method

Apparatus and method for inspecting multi-layer structure method for fabricating semiconductor device comprising the method

Provided are a multilayer structure inspection apparatus and method of inspecting a multilayer structure in a sample without damaging the sample, the multilayer structure inspection apparatus being configured to measure both of reflectance and dispersion without damaging the sample, wherein the refl...

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Hauptverfasser: JUN CHUNG-SAM, KIM JUNG-WON, RYU SUNG-YOON, YANG YU-SIN, KWAK HYUN-SU
Format: Patent
Sprache:chi ; eng
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INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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creator JUN CHUNG-SAM
KIM JUNG-WON
RYU SUNG-YOON
YANG YU-SIN
KWAK HYUN-SU
description Provided are a multilayer structure inspection apparatus and method of inspecting a multilayer structure in a sample without damaging the sample, the multilayer structure inspection apparatus being configured to measure both of reflectance and dispersion without damaging the sample, wherein the reflectance and dispersion are variables which are changed sensitively to a change in a repetitive pattern of the multilayer structure, by measuring values thereof, a structural change of the sample between before and after a process is inspected with high accuracy. 提供了检查样品中的多层结构而不破坏样品的多层结构检测装置和方法，多层结构检查装置配置为测量反射率和色散两者而不破坏样品，其中，反射率和色散是对于多层结构的重复模式的改变灵敏地改变的变量，通过测量其值，以高精确度来检查处理之前与处理之后样品的结构改变。
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subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
title Apparatus and method for inspecting multi-layer structure method for fabricating semiconductor device comprising the method
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