POLYIMIDE FILM

A novel polyimide film is provided. In a first embodiment, for the polyimide film, a coefficient of thermal expansion ([alpha]TMD) in the MD direction and a coefficient of thermal expansion ([alpha]TTD) in the TD direction are set as 2-7 ppm/DEG C, |[alpha]TMD-[alpha]TTD| is set to 2 ppm/DEG C or le...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HIRAMATSU NAOHIKO, OGURA MIKIHIRO, WAGATSUMA RYOUSAKU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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