COPPER FOIL AND COPPER-CLAD LAMINATE COMPRISING SAME

The invention is entitled copper foil and copper-clad laminate comprising same. The purpose of the present invention is to provide a copper foil with which excellent adhesion, transmission characteristics, and heat resistance can be achieved and to provide a copper-clad laminate using the same. This copper foil is characterized in that when the characteristics of the adhesive surface of the copperfoil are expressed using the number Wn of waves and roughness motif mean depth R which are calculated from a roughness motif determined by a motif method defined by JIS B0631:2000, the number Wn of waves is 11-30 per mm and the roughness motif mean depth R is 0.20-1.10 [um]m. 本发明题为"铜箔以及具有该铜箔的覆铜板"。本发明的目的在于，提供种铜箔及使用该铜箔的覆铜板，所述铜箔可实现优异的密合性、传输特性及耐热性。本发明的铜箔的特征在于，在用根据通过JIS B0631：2000规定的图形法(Motif method)确定的粗糙度图形计算出的起伏数Wn及粗糙度图形平均深度R表示铜箔的粘贴表面的特征时，起伏数Wn为11个/mm～30个/mm，且粗糙度图形平均深度R为0.20μm～1.10μm。