Low-temperature quick-curable conductive silver adhesive and preparation method thereof

The invention provides low-temperature quick-curable conductive silver adhesive, made from, by weight, 65-85% of a conductive filler, 6-25% of epoxy resin, 3-20% of a curing agent, 0.2-5% of a stabilizer, 0.1-2% of an accelerant, 0.1-2% of an anti-precipitating agent, and 0.1-2% of a silane coupling agent, wherein the conductive filler is a mixture of silver power and graphene. Compared with the prior art, the low-temperature quick-curable conductive silver adhesive has the advantages that the components promote one another and cooperate jointly so that the adhesive can cure quickly at low temperature, the problem is solved that traditional conductive silver adhesive requires high curing temperature and long time, the problem is effectively solved that devices in actual application cannotbear high temperature or long term baking, production capacity and working efficiency are increased, and energy cost and energy consumption are decreased. 本发明提供种低温快速固化导电银胶，其由以下重量百分比的原料制成：导电填料65～85％；环氧树脂6～25％；固化剂3～20％；稳定剂0.2～5