PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING SUCH A PRINTED CIRCUIT BOARD
The invention relates to a printed circuit board, preferably for use in a fuel fill-level sensor and in a fuel fill-level measuring system, comprising conducting tracks (4, 5) formed on two sides of aceramic substrate (2), wherein the ceramic substrate (2) has at least one metallized hole (3) for th...
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| creator | BRINKIS WALDEMAR ZACHERL JUERGEN MATTMANN ERICH |
| description | The invention relates to a printed circuit board, preferably for use in a fuel fill-level sensor and in a fuel fill-level measuring system, comprising conducting tracks (4, 5) formed on two sides of aceramic substrate (2), wherein the ceramic substrate (2) has at least one metallized hole (3) for through-connection, which hole connects the conducting tracks (4, 5) to each other. The hole (3) of the sintered ceramic substrate (2) is filled with a metal-containing sintering paste introduced under compression pressure. In the fully sintered state, said sintering paste enters into at least one integral bond with the ceramic substrate (2) and completely fills the hole. The invention further relates to a method for producing such a printed circuit board.
本发明涉及种印刷电路板，优选地是在燃料填充液位传感器中使用和在燃料填充液位测量系统中使用的印刷电路板，该印刷电路板具有在陶瓷基板(2)的两侧上形成的导体轨道(4，5)，其中，该陶瓷基板(2)具有至少个用于贯通接触的金属化孔(3)，该孔将这些导体轨道(4，5)连接至彼此。此处，该烧结的陶瓷基板(2)的孔(3)填充有在压力下引入的含金属烧结糊剂，该烧结糊剂在完全烧结状态下与该陶瓷基板(2)形成至少个整体结合，并且在这样做时完全填充该孔。本发明还涉及种用于生产这种印刷电路板的方法。 |
| format | Patent |
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本发明涉及种印刷电路板，优选地是在燃料填充液位传感器中使用和在燃料填充液位测量系统中使用的印刷电路板，该印刷电路板具有在陶瓷基板(2)的两侧上形成的导体轨道(4，5)，其中，该陶瓷基板(2)具有至少个用于贯通接触的金属化孔(3)，该孔将这些导体轨道(4，5)连接至彼此。此处，该烧结的陶瓷基板(2)的孔(3)填充有在压力下引入的含金属烧结糊剂，该烧结糊剂在完全烧结状态下与该陶瓷基板(2)形成至少个整体结合，并且在这样做时完全填充该孔。本发明还涉及种用于生产这种印刷电路板的方法。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190402&DB=EPODOC&CC=CN&NR=109565940A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190402&DB=EPODOC&CC=CN&NR=109565940A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BRINKIS WALDEMAR</creatorcontrib><creatorcontrib>ZACHERL JUERGEN</creatorcontrib><creatorcontrib>MATTMANN ERICH</creatorcontrib><title>PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING SUCH A PRINTED CIRCUIT BOARD</title><description>The invention relates to a printed circuit board, preferably for use in a fuel fill-level sensor and in a fuel fill-level measuring system, comprising conducting tracks (4, 5) formed on two sides of aceramic substrate (2), wherein the ceramic substrate (2) has at least one metallized hole (3) for through-connection, which hole connects the conducting tracks (4, 5) to each other. The hole (3) of the sintered ceramic substrate (2) is filled with a metal-containing sintering paste introduced under compression pressure. In the fully sintered state, said sintering paste enters into at least one integral bond with the ceramic substrate (2) and completely fills the hole. The invention further relates to a method for producing such a printed circuit board.
本发明涉及种印刷电路板，优选地是在燃料填充液位传感器中使用和在燃料填充液位测量系统中使用的印刷电路板，该印刷电路板具有在陶瓷基板(2)的两侧上形成的导体轨道(4，5)，其中，该陶瓷基板(2)具有至少个用于贯通接触的金属化孔(3)，该孔将这些导体轨道(4，5)连接至彼此。此处，该烧结的陶瓷基板(2)的孔(3)填充有在压力下引入的含金属烧结糊剂，该烧结糊剂在完全烧结状态下与该陶瓷基板(2)形成至少个整体结合，并且在这样做时完全填充该孔。本发明还涉及种用于生产这种印刷电路板的方法。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPANCPL0C3F1UXD2DHIO9QxRcPJ3DHJRcPQDYgVf1xAPfxcFN_8ghYAgf5dQZ08_d4XgUGcPoBxWfTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz9DA0tTM1NLEwNGYGDUAqEAtvw</recordid><startdate>20190402</startdate><enddate>20190402</enddate><creator>BRINKIS WALDEMAR</creator><creator>ZACHERL JUERGEN</creator><creator>MATTMANN ERICH</creator><scope>EVB</scope></search><sort><creationdate>20190402</creationdate><title>PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING SUCH A PRINTED CIRCUIT BOARD</title><author>BRINKIS WALDEMAR ; ZACHERL JUERGEN ; MATTMANN ERICH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109565940A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>BRINKIS WALDEMAR</creatorcontrib><creatorcontrib>ZACHERL JUERGEN</creatorcontrib><creatorcontrib>MATTMANN ERICH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BRINKIS WALDEMAR</au><au>ZACHERL JUERGEN</au><au>MATTMANN ERICH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING SUCH A PRINTED CIRCUIT BOARD</title><date>2019-04-02</date><risdate>2019</risdate><abstract>The invention relates to a printed circuit board, preferably for use in a fuel fill-level sensor and in a fuel fill-level measuring system, comprising conducting tracks (4, 5) formed on two sides of aceramic substrate (2), wherein the ceramic substrate (2) has at least one metallized hole (3) for through-connection, which hole connects the conducting tracks (4, 5) to each other. The hole (3) of the sintered ceramic substrate (2) is filled with a metal-containing sintering paste introduced under compression pressure. In the fully sintered state, said sintering paste enters into at least one integral bond with the ceramic substrate (2) and completely fills the hole. The invention further relates to a method for producing such a printed circuit board.
本发明涉及种印刷电路板，优选地是在燃料填充液位传感器中使用和在燃料填充液位测量系统中使用的印刷电路板，该印刷电路板具有在陶瓷基板(2)的两侧上形成的导体轨道(4，5)，其中，该陶瓷基板(2)具有至少个用于贯通接触的金属化孔(3)，该孔将这些导体轨道(4，5)连接至彼此。此处，该烧结的陶瓷基板(2)的孔(3)填充有在压力下引入的含金属烧结糊剂，该烧结糊剂在完全烧结状态下与该陶瓷基板(2)形成至少个整体结合，并且在这样做时完全填充该孔。本发明还涉及种用于生产这种印刷电路板的方法。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING SUCH A PRINTED CIRCUIT BOARD |
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