CONDUCTIVE THERMOPLASTIC POLYAMIDE MOULDING COMPOUND

The invention relates to a polyamide moulding compound consisting of the following components: (A) 35-68 wt.% of at least one semi-crystalline, semi-aromatic, thermoplastic polyamide based on aliphatic diamines with 4-8 carbon atoms with a melting temperature of at least 270 DEG C; (B) 15-22 wt.% ca...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAMBERTS NIKOLAI, BAYER ANDREAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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