GRAPHENE-CONTAINING MATERIALS FOR COATING AND GAP FILLING APPLICATIONS

The present invention proivdes conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present inventio...

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Hauptverfasser: HONG XUAN, CAO XINPEI, SANCHEZ JULIET G, ZHUO QIZHUO
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creator HONG XUAN
CAO XINPEI
SANCHEZ JULIET G
ZHUO QIZHUO
description The present invention proivdes conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods. 本发明提供了导电制剂,其中石墨烯已被添加到金属系统中,从而减少固化收缩并改善柔性,而不显著影响其EMI屏蔽性能。根据本发明的某些方面,还提供了用于填充电子封装中的间隙以实现其电磁干扰(EMI)屏蔽的方法,以及由此屏蔽的所得制品。在本发明的某些方面,还提供了使用本发明制剂和方法制备的制品。
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In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods. 本发明提供了导电制剂,其中石墨烯已被添加到金属系统中,从而减少固化收缩并改善柔性,而不显著影响其EMI屏蔽性能。根据本发明的某些方面,还提供了用于填充电子封装中的间隙以实现其电磁干扰(EMI)屏蔽的方法,以及由此屏蔽的所得制品。在本发明的某些方面,还提供了使用本发明制剂和方法制备的制品。</description><language>chi ; eng</language><subject>ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CASTING ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOUNDS THEREOF ; CONDUCTORS ; CORRECTING FLUIDS ; DECONTAMINATION ARRANGEMENTS THEREFOR ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; INKS ; INORGANIC CHEMISTRY ; INSULATORS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-METALLIC ELEMENTS ; NUCLEAR ENGINEERING ; NUCLEAR PHYSICS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; PHYSICS ; POLISHES ; POWDER METALLURGY ; PRINTED CIRCUITS ; PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; TREATING RADIOACTIVELY CONTAMINATED MATERIAL ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING METALLIC POWDER ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL ; WORKING-UP</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190315&amp;DB=EPODOC&amp;CC=CN&amp;NR=109475941A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190315&amp;DB=EPODOC&amp;CC=CN&amp;NR=109475941A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HONG XUAN</creatorcontrib><creatorcontrib>CAO XINPEI</creatorcontrib><creatorcontrib>SANCHEZ JULIET G</creatorcontrib><creatorcontrib>ZHUO QIZHUO</creatorcontrib><title>GRAPHENE-CONTAINING MATERIALS FOR COATING AND GAP FILLING APPLICATIONS</title><description>The present invention proivdes conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods. 本发明提供了导电制剂,其中石墨烯已被添加到金属系统中,从而减少固化收缩并改善柔性,而不显著影响其EMI屏蔽性能。根据本发明的某些方面,还提供了用于填充电子封装中的间隙以实现其电磁干扰(EMI)屏蔽的方法,以及由此屏蔽的所得制品。在本发明的某些方面,还提供了使用本发明制剂和方法制备的制品。</description><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CASTING</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOUNDS THEREOF</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DECONTAMINATION ARRANGEMENTS THEREFOR</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INKS</subject><subject>INORGANIC CHEMISTRY</subject><subject>INSULATORS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-METALLIC ELEMENTS</subject><subject>NUCLEAR ENGINEERING</subject><subject>NUCLEAR PHYSICS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>POWDER METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>TREATING RADIOACTIVELY CONTAMINATED MATERIAL</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING METALLIC POWDER</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBzD3IM8HD1c9V19vcLcfT08_RzV_B1DHEN8nT0CVZw8w9ScPZ3DAGJOvq5KLg7Bii4efr4gPkBAT6ezkA5f79gHgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWlyQmJyal1oS7-xnaGBpYm5qaWLoaEyMGgClLSxD</recordid><startdate>20190315</startdate><enddate>20190315</enddate><creator>HONG XUAN</creator><creator>CAO XINPEI</creator><creator>SANCHEZ JULIET G</creator><creator>ZHUO QIZHUO</creator><scope>EVB</scope></search><sort><creationdate>20190315</creationdate><title>GRAPHENE-CONTAINING MATERIALS FOR COATING AND GAP FILLING APPLICATIONS</title><author>HONG XUAN ; CAO XINPEI ; SANCHEZ JULIET G ; ZHUO QIZHUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109475941A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CASTING</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOUNDS THEREOF</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DECONTAMINATION ARRANGEMENTS THEREFOR</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INKS</topic><topic>INORGANIC CHEMISTRY</topic><topic>INSULATORS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-METALLIC ELEMENTS</topic><topic>NUCLEAR ENGINEERING</topic><topic>NUCLEAR PHYSICS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>POWDER METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>TREATING RADIOACTIVELY CONTAMINATED MATERIAL</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING METALLIC POWDER</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HONG XUAN</creatorcontrib><creatorcontrib>CAO XINPEI</creatorcontrib><creatorcontrib>SANCHEZ JULIET G</creatorcontrib><creatorcontrib>ZHUO QIZHUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HONG XUAN</au><au>CAO XINPEI</au><au>SANCHEZ JULIET G</au><au>ZHUO QIZHUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GRAPHENE-CONTAINING MATERIALS FOR COATING AND GAP FILLING APPLICATIONS</title><date>2019-03-15</date><risdate>2019</risdate><abstract>The present invention proivdes conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods. 本发明提供了导电制剂,其中石墨烯已被添加到金属系统中,从而减少固化收缩并改善柔性,而不显著影响其EMI屏蔽性能。根据本发明的某些方面,还提供了用于填充电子封装中的间隙以实现其电磁干扰(EMI)屏蔽的方法,以及由此屏蔽的所得制品。在本发明的某些方面,还提供了使用本发明制剂和方法制备的制品。</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVES
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CASTING
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
COMPOUNDS THEREOF
CONDUCTORS
CORRECTING FLUIDS
DECONTAMINATION ARRANGEMENTS THEREFOR
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILLING PASTES
GENERAL PROCESSES OF COMPOUNDING
INKS
INORGANIC CHEMISTRY
INSULATORS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-METALLIC ELEMENTS
NUCLEAR ENGINEERING
NUCLEAR PHYSICS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
PHYSICS
POLISHES
POWDER METALLURGY
PRINTED CIRCUITS
PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
TREATING RADIOACTIVELY CONTAMINATED MATERIAL
USE OF MATERIALS THEREFOR
WOODSTAINS
WORKING METALLIC POWDER
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
WORKING-UP
title GRAPHENE-CONTAINING MATERIALS FOR COATING AND GAP FILLING APPLICATIONS
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