Method for manufacturing FPC inner layer by adopting UV laser drilling type direct electroplating

Method for manufacturing FPC inner layer by adopting UV laser drilling type direct electroplating

The invention discloses a method for manufacturing an FPC inner layer by adopting UV laser drilling type direct electroplating. The method comprises the following steps: 1) inner layer material preparation is carried out: a PI base material soft board is selected according to design specifications;...

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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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creator LIN MUQUN
description The invention discloses a method for manufacturing an FPC inner layer by adopting UV laser drilling type direct electroplating. The method comprises the following steps: 1) inner layer material preparation is carried out: a PI base material soft board is selected according to design specifications; 2) the soft board is cut: the base material soft board is cut by a machine; 3) inner layer drillingis carried out: a cut base material is drilled by adopting UV laser; 4) inner layer film drying is carried out, which comprises surface treatment, filming, exposure, developing, etching and film stripping treatment; 5) electroplating is carried out: electrocoppering treatment is carried out on a substrate and a through hole; and 6) post-processing is carried out. The UV laser drilling type directelectroplating process is adopted to replace traditional mechanical drilling and black hole processes, so that the defects of traditional mechanical drilling are overcome, the complex black hole process is omitted, the product
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Method for manufacturing FPC inner layer by adopting UV laser drilling type direct electroplating
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