Package structure and method for multi-channel microwave-optical conversion component
The invention discloses a package structure and method for a multi-channel microwave-optical conversion component. The package structure comprises a metal casing body, a microwave link, a photon linkand a control circuit, wherein the microwave link, the photon link and the control circuit are arrang...
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| creator | WU YILONG JING FEI QIN YUELI LIAO AO ZHANG TONGTONG YU CHANGXI LYU XIAOMENG |
| description | The invention discloses a package structure and method for a multi-channel microwave-optical conversion component. The package structure comprises a metal casing body, a microwave link, a photon linkand a control circuit, wherein the microwave link, the photon link and the control circuit are arranged in the metal casing body. The inside metal casing body is divided into upper and lower parts. The upper part includes several independent channels used for assembling the microwave link and the photon link. The lower part is used for assembling the control circuit. The invention relates to the package structure and method for the multi-channel microwave-optical conversion component. Package of the multi-channel microwave link, photonic link and control circuit is realized in the same casingbody. The package structure has good heat dissipation and electromagnetic shielding capabilities. The package structure and method can realize airtight package and have high reliability. The package structure and method can re |
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The package structure comprises a metal casing body, a microwave link, a photon linkand a control circuit, wherein the microwave link, the photon link and the control circuit are arranged in the metal casing body. The inside metal casing body is divided into upper and lower parts. The upper part includes several independent channels used for assembling the microwave link and the photon link. The lower part is used for assembling the control circuit. The invention relates to the package structure and method for the multi-channel microwave-optical conversion component. Package of the multi-channel microwave link, photonic link and control circuit is realized in the same casingbody. The package structure has good heat dissipation and electromagnetic shielding capabilities. The package structure and method can realize airtight package and have high reliability. 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The package structure comprises a metal casing body, a microwave link, a photon linkand a control circuit, wherein the microwave link, the photon link and the control circuit are arranged in the metal casing body. The inside metal casing body is divided into upper and lower parts. The upper part includes several independent channels used for assembling the microwave link and the photon link. The lower part is used for assembling the control circuit. The invention relates to the package structure and method for the multi-channel microwave-optical conversion component. Package of the multi-channel microwave link, photonic link and control circuit is realized in the same casingbody. The package structure has good heat dissipation and electromagnetic shielding capabilities. The package structure and method can realize airtight package and have high reliability. The package structure and method can re</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</subject><subject>WAVEGUIDES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEKwkAQQNE0FqLeYTxAIBIRU0pQrMRC6zBMJmZxd2bZnej1tfAAVv8Vf17cr0hPfDBkSxPZlBhQeghso_YwaIIweXMljSjCHoKjpG98canRHKEHUnlxyk7lyxBVWGxZzAb0mVe_Lor16XhrzyVH7ThHJBa2rr1sqqZuqt12f6j_eT425DoU</recordid><startdate>20190226</startdate><enddate>20190226</enddate><creator>WU YILONG</creator><creator>JING FEI</creator><creator>QIN YUELI</creator><creator>LIAO AO</creator><creator>ZHANG TONGTONG</creator><creator>YU CHANGXI</creator><creator>LYU XIAOMENG</creator><scope>EVB</scope></search><sort><creationdate>20190226</creationdate><title>Package structure and method for multi-channel microwave-optical conversion component</title><author>WU YILONG ; JING FEI ; QIN YUELI ; LIAO AO ; ZHANG TONGTONG ; YU CHANGXI ; LYU XIAOMENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109390648A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</topic><topic>WAVEGUIDES</topic><toplevel>online_resources</toplevel><creatorcontrib>WU YILONG</creatorcontrib><creatorcontrib>JING FEI</creatorcontrib><creatorcontrib>QIN YUELI</creatorcontrib><creatorcontrib>LIAO AO</creatorcontrib><creatorcontrib>ZHANG TONGTONG</creatorcontrib><creatorcontrib>YU CHANGXI</creatorcontrib><creatorcontrib>LYU XIAOMENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WU YILONG</au><au>JING FEI</au><au>QIN YUELI</au><au>LIAO AO</au><au>ZHANG TONGTONG</au><au>YU CHANGXI</au><au>LYU XIAOMENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package structure and method for multi-channel microwave-optical conversion component</title><date>2019-02-26</date><risdate>2019</risdate><abstract>The invention discloses a package structure and method for a multi-channel microwave-optical conversion component. 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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES |
| title | Package structure and method for multi-channel microwave-optical conversion component |
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