Production process of double-layer composite electrolytic copper foil
The invention discloses a production technology of a double-layer composite electrolytic copper foil. A specific technical process comprises the following steps of adding pure copper sheets and waterinto a dissolution groove; meanwhile, adding concentrated sulfuric acid into the dissolution groove;...
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creator | ZHOU XIQUAN |
description | The invention discloses a production technology of a double-layer composite electrolytic copper foil. A specific technical process comprises the following steps of adding pure copper sheets and waterinto a dissolution groove; meanwhile, adding concentrated sulfuric acid into the dissolution groove; inflating air into the dissolution groove; filtering a prepared copper sulfate solution, and then adding into an electrolysis groove; meanwhile, adding an additive into the electrolysis groove; under the effect of an electric field, preparing a primary copper foil; cleaning a surface oxide layer ofthe primary copper foil in an acid washing groove; then, respectively coating the surface of the copper foil with an anti-oxidization layer and a reduction layer; next, performing cutting and packaging on the prepared copper foil to obtain a copper foil finished product. The copper foil has the advantages that in a later period of production, the surface of the copper foil is coated with the anti-oxidization layer at firs |
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A specific technical process comprises the following steps of adding pure copper sheets and waterinto a dissolution groove; meanwhile, adding concentrated sulfuric acid into the dissolution groove; inflating air into the dissolution groove; filtering a prepared copper sulfate solution, and then adding into an electrolysis groove; meanwhile, adding an additive into the electrolysis groove; under the effect of an electric field, preparing a primary copper foil; cleaning a surface oxide layer ofthe primary copper foil in an acid washing groove; then, respectively coating the surface of the copper foil with an anti-oxidization layer and a reduction layer; next, performing cutting and packaging on the prepared copper foil to obtain a copper foil finished product. 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A specific technical process comprises the following steps of adding pure copper sheets and waterinto a dissolution groove; meanwhile, adding concentrated sulfuric acid into the dissolution groove; inflating air into the dissolution groove; filtering a prepared copper sulfate solution, and then adding into an electrolysis groove; meanwhile, adding an additive into the electrolysis groove; under the effect of an electric field, preparing a primary copper foil; cleaning a surface oxide layer ofthe primary copper foil in an acid washing groove; then, respectively coating the surface of the copper foil with an anti-oxidization layer and a reduction layer; next, performing cutting and packaging on the prepared copper foil to obtain a copper foil finished product. The copper foil has the advantages that in a later period of production, the surface of the copper foil is coated with the anti-oxidization layer at firs</description><subject>APPARATUS THEREFOR</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHANKMpPKU0uyczPUygoyk9OLS5WyE9TSMkvTcpJ1c1JrEwtUkjOzy3IL84sSVVIzUlNLinKz6ksyUwGChcUAGXT8jNzeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGlkZm5oaGBozExagBJ7zPb</recordid><startdate>20190125</startdate><enddate>20190125</enddate><creator>ZHOU XIQUAN</creator><scope>EVB</scope></search><sort><creationdate>20190125</creationdate><title>Production process of double-layer composite electrolytic copper foil</title><author>ZHOU XIQUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109267110A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHOU XIQUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHOU XIQUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Production process of double-layer composite electrolytic copper foil</title><date>2019-01-25</date><risdate>2019</risdate><abstract>The invention discloses a production technology of a double-layer composite electrolytic copper foil. A specific technical process comprises the following steps of adding pure copper sheets and waterinto a dissolution groove; meanwhile, adding concentrated sulfuric acid into the dissolution groove; inflating air into the dissolution groove; filtering a prepared copper sulfate solution, and then adding into an electrolysis groove; meanwhile, adding an additive into the electrolysis groove; under the effect of an electric field, preparing a primary copper foil; cleaning a surface oxide layer ofthe primary copper foil in an acid washing groove; then, respectively coating the surface of the copper foil with an anti-oxidization layer and a reduction layer; next, performing cutting and packaging on the prepared copper foil to obtain a copper foil finished product. The copper foil has the advantages that in a later period of production, the surface of the copper foil is coated with the anti-oxidization layer at firs</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | Production process of double-layer composite electrolytic copper foil |
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