A PCB laminating structure and a laminating method based on a buffer material
The invention discloses a PCB laminating structure and method based on a buffer material, wherein the intermediate layer is a mirror steel plate and a laminated unit; The mirror steel plate is symmetrically distributed on the upper and lower sides of the lamination unit, a plurality of substrate uni...
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| creator | ZHU ZHONGHAN CUI LIANGDUAN FAN XIAOCHUN GUAN MEIZHANG DENG JIAN PENG TENG DAI YINHAI CHEN YANQING JIN JUN SHEN YUEFENG NIU SHUNYI |
| description | The invention discloses a PCB laminating structure and method based on a buffer material, wherein the intermediate layer is a mirror steel plate and a laminated unit; The mirror steel plate is symmetrically distributed on the upper and lower sides of the lamination unit, a plurality of substrate units are arranged in the lamination unit, and mirror steel plates are arranged between adjacent substrate units. The substrate unit comprises: a plate to be pressed, a buffer layer symmetrically distributed on the upper and lower sides of the plate to be pressed; The buffer layer comprises a release film and a buffer material, and the release film is symmetrically distributed on the upper and lower sides of the buffer material; The buffer material is a prepreg. The FR The prepreg is used as cushioning material, which improves the uniformity of temperature and pressure in pressing process, is beneficial to the thickness control of plate, and avoids the appearance of white spots after pressing and the phenomenon of del |
| format | Patent |
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The substrate unit comprises: a plate to be pressed, a buffer layer symmetrically distributed on the upper and lower sides of the plate to be pressed; The buffer layer comprises a release film and a buffer material, and the release film is symmetrically distributed on the upper and lower sides of the buffer material; The buffer material is a prepreg. The FR The prepreg is used as cushioning material, which improves the uniformity of temperature and pressure in pressing process, is beneficial to the thickness control of plate, and avoids the appearance of white spots after pressing and the phenomenon of del</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190115&DB=EPODOC&CC=CN&NR=109219273A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190115&DB=EPODOC&CC=CN&NR=109219273A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHU ZHONGHAN</creatorcontrib><creatorcontrib>CUI LIANGDUAN</creatorcontrib><creatorcontrib>FAN XIAOCHUN</creatorcontrib><creatorcontrib>GUAN MEIZHANG</creatorcontrib><creatorcontrib>DENG JIAN</creatorcontrib><creatorcontrib>PENG TENG</creatorcontrib><creatorcontrib>DAI YINHAI</creatorcontrib><creatorcontrib>CHEN YANQING</creatorcontrib><creatorcontrib>JIN JUN</creatorcontrib><creatorcontrib>SHEN YUEFENG</creatorcontrib><creatorcontrib>NIU SHUNYI</creatorcontrib><title>A PCB laminating structure and a laminating method based on a buffer material</title><description>The invention discloses a PCB laminating structure and method based on a buffer material, wherein the intermediate layer is a mirror steel plate and a laminated unit; The mirror steel plate is symmetrically distributed on the upper and lower sides of the lamination unit, a plurality of substrate units are arranged in the lamination unit, and mirror steel plates are arranged between adjacent substrate units. The substrate unit comprises: a plate to be pressed, a buffer layer symmetrically distributed on the upper and lower sides of the plate to be pressed; The buffer layer comprises a release film and a buffer material, and the release film is symmetrically distributed on the upper and lower sides of the buffer material; The buffer material is a prepreg. 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The substrate unit comprises: a plate to be pressed, a buffer layer symmetrically distributed on the upper and lower sides of the plate to be pressed; The buffer layer comprises a release film and a buffer material, and the release film is symmetrically distributed on the upper and lower sides of the buffer material; The buffer material is a prepreg. The FR The prepreg is used as cushioning material, which improves the uniformity of temperature and pressure in pressing process, is beneficial to the thickness control of plate, and avoids the appearance of white spots after pressing and the phenomenon of del</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | A PCB laminating structure and a laminating method based on a buffer material |
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