VACUUM SYSTEM AND METHOD OF DEPOSITING ONE OR MORE MATERIALS ON A SUBSTRATE

A vacuum system (100) for depositing one or more materials on a substrate is described. The vacuum system (100) comprises a first transport system (110) configured to transport a substrate (10) alonga main transport path (101) in a main transport direction (P), and at least one deposition module (10...

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Bibliographische Detailangaben
1. Verfasser:	HEIMEL OLIVER
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A vacuum system (100) for depositing one or more materials on a substrate is described. The vacuum system (100) comprises a first transport system (110) configured to transport a substrate (10) alonga main transport path (101) in a main transport direction (P), and at least one deposition module (104) extending in a transverse direction (T) with respect to the main transport direction (P). The first transport system (110) is configured to hold the substrate (10) in an orientation which is essentially parallel to the transverse direction (T) during the transport. Further, a method of depositing one or more materials on a substrate is described, particularly by evaporation. 描述种用于在基板上沉积种或多种材料的真空系统(100)。真空系统(100)包括：第运输系统(110)，经配置以在主要运输方向(P)上沿着主要运输路径(101)运输基板(10)；和至少个沉积模块(104)，在相对于主要运输方向(P)的横向方向(T)上延伸。第运输系统(110)经配置以在运输期间将基板(10)固持在基本上平行于横向方向(T)的取向上。此外，描述种在基板上沉积、特别地通过蒸发来沉积种或多种材料的方法。