Novel liquid cooler and semiconductor laser packaging structure

The embodiment of the invention provides a novel liquid refrigerator and a semiconductor laser packaging structure. The refrigerator comprises a liquid inlet layer, a liquid inlet layer, a liquid barrier layer, a heat dissipation layer and a cover layer from bottom to top. Wherein the liquid inlet layer is provided with a liquid inlet hole and a liquid outlet hole, and the cover plate layer is used for sealing the heat dissipation layer; At least one of that liquid inlet lay, the liquid barrier lay and the heat dissipation layer is provided with a microchannel correspond to each light emittingpoint of the laser chip, and the heat dissipation capacity of the microchannel is gradient distribution, so that the junction temperature of each light emitting point is kept consistent. Based on theliquid refrigerator and the semiconductor laser packaging structure provided by the invention, the thermal crosstalk effect among the light emitting points of the laser chip can be effectively reduced, the junction temperatur