A manufacturing method of PCB back drill hole

The invention discloses a manufacturing method of PCB back drill hole, which comprises the following steps: laminating, drilling through holes, chemical copper precipitation, electroplating copper, whole plate tin plating, drilling back drilling, tin removing, pre-drying plate, resin plug hole, dryi...

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Bibliographische Detailangaben
Hauptverfasser:	CUI LIANGDUAN, ZHU ZHONGHAN, FAN XIAOCHUN, GUAN MEIZHANG, PENG TENG, ZHU ZHENGDA, DAI YINHAI, CHEN YANQING, SHEN YUEFENG, NIU SHUNYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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