EEPROM chip assembly method

The invention relates to an EEPROM chip assembly method, belonging to the electronic industry assembly process field, in particular to an EEPROM chip assembly method of an optical fiber gyro inertialmeasurement device, which can be applied to the technical field of aerospace inertial measurement. Th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MENG XIANGTAO, ZUO MINGLU, WANG JILIN, WANG NING, QI BINGXIA, LIU LING, YAO JUNHUA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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