EEPROM chip assembly method
The invention relates to an EEPROM chip assembly method, belonging to the electronic industry assembly process field, in particular to an EEPROM chip assembly method of an optical fiber gyro inertialmeasurement device, which can be applied to the technical field of aerospace inertial measurement. Th...
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| creator | MENG XIANGTAO ZUO MINGLU WANG JILIN WANG NING QI BINGXIA LIU LING YAO JUNHUA |
| description | The invention relates to an EEPROM chip assembly method, belonging to the electronic industry assembly process field, in particular to an EEPROM chip assembly method of an optical fiber gyro inertialmeasurement device, which can be applied to the technical field of aerospace inertial measurement. The invention does not need to add a program downloading interface, not only saves installation space, but also meets the product performance requirements. The invention realizes the mounting and fixing of the components by using the EEPROM chip which is flipped on the circuit board by using the brocade silk wire, and meets the mechanical performance requirements. The invention realizes the electrical connection between the EEPROM chip lead wire and the printed circuit board by using the lead wire, and meets the electrical performance requirements.
本发明涉及种EEPROM芯片的装配方法，属于电子行业装配工艺领域，特别涉及种光纤陀螺惯性测量装置EEPROM芯片的装配方法，可应用于宇航惯性测量技术领域。本发明不需要增加程序下载接口，不仅节省了安装空间，也满足了产品性能要求；本发明通过使用锦丝线绑扎倒装在电路板上的EEPROM芯片实现元器件的安装和固定，满足了力学性能要求；本发明通过使用导 |
| format | Patent |
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本发明涉及种EEPROM芯片的装配方法，属于电子行业装配工艺领域，特别涉及种光纤陀螺惯性测量装置EEPROM芯片的装配方法，可应用于宇航惯性测量技术领域。本发明不需要增加程序下载接口，不仅节省了安装空间，也满足了产品性能要求；本发明通过使用锦丝线绑扎倒装在电路板上的EEPROM芯片实现元器件的安装和固定，满足了力学性能要求；本发明通过使用导</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181116&DB=EPODOC&CC=CN&NR=108834327A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181116&DB=EPODOC&CC=CN&NR=108834327A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MENG XIANGTAO</creatorcontrib><creatorcontrib>ZUO MINGLU</creatorcontrib><creatorcontrib>WANG JILIN</creatorcontrib><creatorcontrib>WANG NING</creatorcontrib><creatorcontrib>QI BINGXIA</creatorcontrib><creatorcontrib>LIU LING</creatorcontrib><creatorcontrib>YAO JUNHUA</creatorcontrib><title>EEPROM chip assembly method</title><description>The invention relates to an EEPROM chip assembly method, belonging to the electronic industry assembly process field, in particular to an EEPROM chip assembly method of an optical fiber gyro inertialmeasurement device, which can be applied to the technical field of aerospace inertial measurement. The invention does not need to add a program downloading interface, not only saves installation space, but also meets the product performance requirements. The invention realizes the mounting and fixing of the components by using the EEPROM chip which is flipped on the circuit board by using the brocade silk wire, and meets the mechanical performance requirements. The invention realizes the electrical connection between the EEPROM chip lead wire and the printed circuit board by using the lead wire, and meets the electrical performance requirements.
本发明涉及种EEPROM芯片的装配方法，属于电子行业装配工艺领域，特别涉及种光纤陀螺惯性测量装置EEPROM芯片的装配方法，可应用于宇航惯性测量技术领域。本发明不需要增加程序下载接口，不仅节省了安装空间，也满足了产品性能要求；本发明通过使用锦丝线绑扎倒装在电路板上的EEPROM芯片实现元器件的安装和固定，满足了力学性能要求；本发明通过使用导</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB2dQ0I8vdVSM7ILFBILC5OzU3KqVTITS3JyE_hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBhYWxibGRuaOxsSoAQAnICK3</recordid><startdate>20181116</startdate><enddate>20181116</enddate><creator>MENG XIANGTAO</creator><creator>ZUO MINGLU</creator><creator>WANG JILIN</creator><creator>WANG NING</creator><creator>QI BINGXIA</creator><creator>LIU LING</creator><creator>YAO JUNHUA</creator><scope>EVB</scope></search><sort><creationdate>20181116</creationdate><title>EEPROM chip assembly method</title><author>MENG XIANGTAO ; ZUO MINGLU ; WANG JILIN ; WANG NING ; QI BINGXIA ; LIU LING ; YAO JUNHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108834327A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MENG XIANGTAO</creatorcontrib><creatorcontrib>ZUO MINGLU</creatorcontrib><creatorcontrib>WANG JILIN</creatorcontrib><creatorcontrib>WANG NING</creatorcontrib><creatorcontrib>QI BINGXIA</creatorcontrib><creatorcontrib>LIU LING</creatorcontrib><creatorcontrib>YAO JUNHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MENG XIANGTAO</au><au>ZUO MINGLU</au><au>WANG JILIN</au><au>WANG NING</au><au>QI BINGXIA</au><au>LIU LING</au><au>YAO JUNHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EEPROM chip assembly method</title><date>2018-11-16</date><risdate>2018</risdate><abstract>The invention relates to an EEPROM chip assembly method, belonging to the electronic industry assembly process field, in particular to an EEPROM chip assembly method of an optical fiber gyro inertialmeasurement device, which can be applied to the technical field of aerospace inertial measurement. The invention does not need to add a program downloading interface, not only saves installation space, but also meets the product performance requirements. The invention realizes the mounting and fixing of the components by using the EEPROM chip which is flipped on the circuit board by using the brocade silk wire, and meets the mechanical performance requirements. The invention realizes the electrical connection between the EEPROM chip lead wire and the printed circuit board by using the lead wire, and meets the electrical performance requirements.
本发明涉及种EEPROM芯片的装配方法，属于电子行业装配工艺领域，特别涉及种光纤陀螺惯性测量装置EEPROM芯片的装配方法，可应用于宇航惯性测量技术领域。本发明不需要增加程序下载接口，不仅节省了安装空间，也满足了产品性能要求；本发明通过使用锦丝线绑扎倒装在电路板上的EEPROM芯片实现元器件的安装和固定，满足了力学性能要求；本发明通过使用导</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | EEPROM chip assembly method |
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