Metal thin board defect positioning method based on active sweep frequency acoustic excitation
The invention discloses a metal thin board defect positioning method based on active sweep frequency acoustic excitation. The method comprises four steps including device laying, signal acquisition, signal processing, and defect positioning. The method is capable of obtaining defect position curves...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a metal thin board defect positioning method based on active sweep frequency acoustic excitation. The method comprises four steps including device laying, signal acquisition, signal processing, and defect positioning. The method is capable of obtaining defect position curves through time delay information, and determining defect positions based on the crossing points of thedefect position curves. The beneficial effects are that: the metal thin board defect positioning method based on active sweep frequency acoustic excitation is disclosed, defect positioning can be realized without in advance obtaining of guide wave propagation velocity, and positioning accuracy is relatively high.
本发明提出了种基于主动扫频声激励的金属薄板缺陷定位方法,所述方法包括:装置布设、信号获取、信号处理、缺陷定位四个步骤;该方法能通过时延信息得到缺陷位置曲线,然后根据缺陷位置曲线的交点确定缺陷位置;本发明的有益技术效果是:提出了种基于主动扫频声激励的金属薄板缺陷定位方法,该方法不需要预先知道导波传播速度即可实现缺陷定位,定位的准确性较高。 |
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