Apparatus and method for packaging planar electrode chip

The invention relates to an apparatus and method for packaging planar electrode chips. The apparatus for packaging the planar electrode chips is characterized in that the electrode chips are directlymolded by injection and packaged in an outer shell and has a flat structure. Further related to is an electrical transfection base used in cooperation with the apparatus for packaging the planar electrode chips. The apparatus and method for packaging the planar electrode chips have the advantages that the preparation method of the apparatus is simple, low in cost, simple in structure, and easy tooperate; according to the needs of users, the structure of the outer shell can be adjusted to adapt to different electrode base interfaces; applicability is strong; capacity of a columnar cavity can be adjustable and meet different cell processing of different capacities. 本发明涉及种封装平面电极芯片的装置，所述电极芯片直接注塑封装在外壳内部，呈扁平结构。还涉及种与封装平面电极芯片的装置配合使用的电转染基座。本发明装置制备方法简单，成本低，结构简单，易于操作，同时可根据用户的需求，调整外壳的结构以适应不同的电极基座接口，适用性强，也可调整柱状腔体的容量大小，满足不同容量的细