METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD

Disclosed is a method for producing a wiring board, wherein desmearing is adequately carried out without roughening the surface of an insulating layer. This production process of a wiring board comprises: a light irradiation step wherein a wiring board material is irradiated with ultraviolet light in an atmosphere containing oxygen, said wiring board material being obtained by laminating an insulating layer (12) on a conductive layer (11), forming a protective layer (13) on the insulating layer (12), and then forming a through hole (via hole) (12a) that penetrates through the insulating layer(12) and the protective layer (13); and a plating step wherein a plating layer (14) formed of a conductive material is formed on the surface of the wiring board material, said surface containing the bottom of the through hole (12a), after separating the protective layer (13) from the wiring board material. 本发明公开了种布线基板的制造方法，其在不将绝缘层表面粗糙化的情况下适当地进行去胶渣处理。布线基板的制造工序包括：光照射工序，其中，对在导电层(11)上层叠绝缘层(12)、在该绝缘层(12)上形成保护层(13)、且形成有贯通绝缘层(12