Microchannel flat plate loop heat pipe
The invention provides a flat plate type micro ring heat pipe which comprises a main board and an upper cover board. The upper cover board and the main board are packaged together. The main board comprises an evaporation chamber and a condensation chamber. Steam pipelines and a liquid pipeline are c...
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| creator | CHEN ZI'ANG GUO CHUNSHENG TONG XINGHUA NIAN XIANBO |
| description | The invention provides a flat plate type micro ring heat pipe which comprises a main board and an upper cover board. The upper cover board and the main board are packaged together. The main board comprises an evaporation chamber and a condensation chamber. Steam pipelines and a liquid pipeline are connected between the evaporation chamber and the condensation chamber. A porous medium thin piece isarranged in the evaporation chamber. A cavity is arranged in the upper cover board and is arranged at the position opposite to the porous medium thin piece. The cavity communicates with the steam pipelines. The thickness of the thin piece is the same as that of a channel way of the evaporation chamber of the main board. The upper surface of the porous medium thin piece cannot exceed the upper surface of the main board. According to the flat plate type micro ring heat pipe, the thickness of the thin piece is the same as that of the channel way of the evaporation chamber of the main board, theupper surface of the porou |
| format | Patent |
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The upper cover board and the main board are packaged together. The main board comprises an evaporation chamber and a condensation chamber. Steam pipelines and a liquid pipeline are connected between the evaporation chamber and the condensation chamber. A porous medium thin piece isarranged in the evaporation chamber. A cavity is arranged in the upper cover board and is arranged at the position opposite to the porous medium thin piece. The cavity communicates with the steam pipelines. The thickness of the thin piece is the same as that of a channel way of the evaporation chamber of the main board. The upper surface of the porous medium thin piece cannot exceed the upper surface of the main board. 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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN108709443A |
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| subjects | BLASTING HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING WEAPONS |
| title | Microchannel flat plate loop heat pipe |
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