Homogenous low-heat-conductivity inorganic heat insulation board and preparation method thereof
The invention discloses a homogenous low-heat-conductivity inorganic heat insulation board and a preparation method thereof. The homogenous low-heat-conductivity inorganic heat insulation board is prepared from the reaction of an inorganic material, filler and polyurethane hard foam and prepared fro...
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| creator | XING XIAOGANG ZHU LIJUAN HUANG JIANHUA WEI HUA FU ZHENHUA YANG ZHIFENG YUAN HAISHUN ZHU AIDONG |
| description | The invention discloses a homogenous low-heat-conductivity inorganic heat insulation board and a preparation method thereof. The homogenous low-heat-conductivity inorganic heat insulation board is prepared from the reaction of an inorganic material, filler and polyurethane hard foam and prepared from the following raw materials in parts by weight: 31 to 85 parts of the inorganic material, 0 to 20parts of the filler, and 15 to 49 parts of the polyurethane hard foam. The heat conduction coefficient of the prepared insulation board is less than 40mW/(m.K), the integral density is 35 to 500 kg/m , and the thermal insulation and heat preservation performance is good. The compressive strength is greater than or equal to 0.1MPa, the tensile strength is greater than or equal to 0.1MPa, the mechanical strength is high, and the durability is good. The oxygen index is greater than or equal to 30 percent, the combustion growth rate index is less than or equal to 120W/s, the total heat release amount in 600s is less than |
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The homogenous low-heat-conductivity inorganic heat insulation board is prepared from the reaction of an inorganic material, filler and polyurethane hard foam and prepared from the following raw materials in parts by weight: 31 to 85 parts of the inorganic material, 0 to 20parts of the filler, and 15 to 49 parts of the polyurethane hard foam. The heat conduction coefficient of the prepared insulation board is less than 40mW/(m.K), the integral density is 35 to 500 kg/m , and the thermal insulation and heat preservation performance is good. The compressive strength is greater than or equal to 0.1MPa, the tensile strength is greater than or equal to 0.1MPa, the mechanical strength is high, and the durability is good. 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| subjects | ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE LIME, MAGNESIA METALLURGY REFRACTORIES SLAG TREATMENT OF NATURAL STONE |
| title | Homogenous low-heat-conductivity inorganic heat insulation board and preparation method thereof |
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